Package Substrate Lid Structure for Heat Dissipation and Glass Protection
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Solution Overview
Problem
Conventional package substrates suffer from limited heat dissipation characteristics, leading to reduced reliability and mechanical vulnerability, especially with the use of glass substrates, which can be damaged during processing and integrated circuits face electrical defects due to poor thermal management.
Innovation Solution
A substrate with a specially designed lid structure featuring a glass base and a lid structure that includes an accommodation space and a frame, divided into inner and outer regions, with enhanced thermal conductivity and mechanical properties, incorporating a redistribution layer and side closing portions to protect and dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a wire is exposed to form a wire bonding pad, then wire bonding can be performed, but the bonding pad occupies additional chip area and increases the number of chip formation processes
Solution Approach 1:
The patent combines the bonding pad function with the lead frame structure by forming the bonding pad on the lead frame body rather than exposing a separate wire on the chip. This integration eliminates the need for additional chip area dedicated to bonding pads and reduces the number of chip formation processes while maintaining wire bonding capability.
2Ease of manufacture
If a bonding pad is formed on the chip, then wire bonding can be performed, but the number of chip formation processes increases
Solution Approach 1:
The bonding pad is formed on the lead frame body during lead frame processing rather than as a separate step on the chip. This merging of functions reduces the number of chip formation processes while enabling wire bonding.
Solution Approach 2:
The lead frame body serves as an intermediary structure that provides the bonding pad function, eliminating the need for direct bonding pad formation on the chip and thereby reducing process complexity.
3Reliability
If the lead frame body has a large area, then it can serve as an effective bonding pad, but the overall package size increases
Solution Approach 1:
The lead frame body is designed with localized bonding pad regions that have the necessary electrical and mechanical properties for effective wire bonding, while other areas maintain their structural functions. This localized approach ensures bonding effectiveness without requiring the entire lead frame body to be enlarged.
Solution Approach 2:
The lead frame body serves multiple functions simultaneously: it provides structural support, electrical connection, and bonding pad functionality. This multi-functionality eliminates the need for separate bonding pad structures and reduces overall package size while maintaining bonding effectiveness.
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
Example embodiments provide a package substrate including a lid structure. The package substrate includes a substrate, a semiconductor element arranged on one surface of the substrate, and a lid surrounding at least a portion of the semiconductor element with an accommodation space for housing the element and a frame surrounding a portion of the accommodation space. The lid includes an inner and outer region. The outer region of the lid extends outwardly beyond the outer periphery of the substrate.