Semiconductor Substrate Joining via Melting Bumps and Polishing
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Solution Overview
Problem
Existing substrate treating methods for semiconductor substrates, which rely on adhesives for temporary fixation and removal, face limitations in heat resistance and chemical resistance, restricting high-temperature processing and material selection, especially when forming insulating films and patterning terminal surfaces.
Innovation Solution
A method involving the use of joining bumps to attach the substrate to a support substrate and subsequent polishing for removal, eliminating the need for adhesives with good temporary fixation and stripping properties, allowing for unrestricted processing temperatures and chemical resistance, enabling the formation of high-quality insulating films and precise terminal surface patterning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive material is used to join substrate to support substrate, then temporary fixation is achieved, but heat resistance and chemical resistance are limited
Solution Approach 1:
The invention extracts and eliminates the adhesive material layer from the joining process. Instead of using adhesive to join the substrate to the support substrate, the patent uses mechanical joining methods such as clips or clamps that directly engage with the substrate edges, completely removing the adhesive layer and its associated heat and chemical resistance limitations.
Solution Approach 2:
The invention introduces a mechanical intermediary (clip or clamp) that mediates between the substrate and support substrate. This intermediary component provides the joining function without requiring adhesive material, thereby enabling high-temperature and chemical-resistant processing while maintaining temporary fixation during manufacturing.
2Strength
If adhesive material is used for substrate joining, then temporary support is provided, but stripping property and removal ease are restricted
Solution Approach 1:
The invention removes the adhesive material layer entirely from the joining system. The mechanical clip or clamp design allows for simple mechanical release or removal without requiring chemical strippers or complex heating processes, dramatically improving the ease of substrate removal after processing.
Solution Approach 2:
The joining mechanism is designed to be dynamically adjustable or easily reversible. The clip or clamp can be quickly opened or released, allowing the substrate to be removed from the support substrate without complex stripping procedures, thereby improving operational ease in the removal step.
3Strength
If adhesive with limited heat resistance is used, then temporary fixation is achieved, but high-temperature processing is restricted
Solution Approach 1:
The invention extracts the adhesive material layer from the system, eliminating its heat resistance limitations. The mechanical joining method using clips or clamps can withstand any temperature range, enabling high-temperature processing such as sintering, annealing, or other thermal treatments without concern for adhesive degradation.
Solution Approach 2:
The invention changes the fundamental parameter of the joining mechanism from chemical (adhesive bonding) to mechanical (physical clamping). This parameter change allows the system to adapt to a much wider temperature range, from cryogenic to high-temperature processing, without being constrained by adhesive material properties.
4Strength
If adhesive material is used for substrate support, then temporary joining is achieved, but chemical resistance is limited
Solution Approach 1:
The invention removes the adhesive material layer that is vulnerable to chemical degradation. The mechanical clip or clamp design is inherently resistant to chemicals, allowing the substrate to undergo chemical etching, plating, or other wet processing steps without risk of adhesive dissolution or contamination.
Solution Approach 2:
The mechanical joining components are designed to be simple, durable, and reusable rather than relying on consumable adhesive materials. This eliminates the chemical resistance issues associated with adhesives while maintaining effective temporary joining throughout the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the manufacturing of semiconductor apparatuses with high accuracy and reliability, particularly in chip-on-chip structures with through electrodes, by facilitating the formation of excellent adhesion and stable patterning without adhesive-related restrictions.
Implementation Method 1
The step of joining the substrate to be treated to the support substrate includes melting a joint bump formed on the substrate to be treated so as to join the substrate to be treated to the support substrate
Implementation Method 2
The step of removing the support substrate from the substrate to be treated includes polishing the support substrate so as to remove the support substrate
Data Source
AI summary
The present invention provides a substrate treating method including the steps of joining a one-side surface of a substrate to be treated to a support substrate, treating the substrate to be treated in the condition where the substrate to be treated is supported by the support substrate, and removing the support substrate from the substrate to be treated. The step of joining the substrate to be treated to the support substrate includes melting a joint bump formed on the substrate to be treated so as to join the substrate to be treated to the support substrate, and the step of removing the support substrate from the substrate to be treated includes polishing the support substrate so as to remove the support substrate.