Substrate Processing with Modified Layers for Selective Film Formation
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Solution Overview
Problem
Existing substrate processing methods lack the ability to control the progression and inhibition of processing on specific areas of a substrate effectively.
Innovation Solution
A method involving alternating steps of supplying a first modifying gas to form a modified layer, removing a portion of it with a first removal gas, and then selectively processing areas with a process gas and reactant gas, repeated a predetermined number of times, to control the processing on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a film is formed on the substrate using a substance that inhibits adsorption, then the film formation is promoted, but the ability to control processing areas on the substrate is insufficient
Solution Approach 1:
The patent applies local quality by creating modified layers with different properties in different areas of the substrate. The first modifying gas forms a first modified layer that inhibits adsorption in specific regions, while the second modifying gas forms a second modified layer with different inhibition characteristics in other regions. This allows the process gas to be selectively adsorbed in predetermined areas, achieving precise spatial control over film formation while maintaining the adsorption inhibition function where needed.
Solution Approach 2:
The patent segments the substrate surface into multiple functional zones by forming distinct first and second modified layers with different adsorption inhibition properties. The first modified layer covers certain areas to prevent unwanted adsorption, while the second modified layer covers other areas with different inhibition characteristics, allowing the process gas to be directed to specific regions. This segmentation enables independent control of processing in different substrate areas.
2Manufacturing precision
If modifying gas is supplied to form modified layer and then removed, then processing control is improved, but the process complexity increases
Solution Approach 1:
The patent applies preliminary action by forming the first modified layer before supplying the process gas, which pre-determines the areas where adsorption will be inhibited. The first modifying gas is supplied in advance to create the initial spatial pattern of inhibition, and then the second modifying gas is supplied to refine or modify this pattern. This preliminary structuring of the substrate surface allows for precise control of subsequent film formation without requiring complex real-time adjustments during the main processing step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows precise control over where processing occurs and inhibits it where necessary, enhancing the formation of desired films on the substrate.
Implementation Method 1
supplying a first modifying gas to the substrate to form a first modified layer on at least a portion of the substrate
Implementation Method 2
supplying a first removal gas to the substrate to remove a portion of the first modified layer from the substrate
Implementation Method 3
supplying a process gas to the substrate to preferentially process an area where the first modified layer is not formed over an area where the first modified layer is present
Data Source
AI summary
There is provided a technique that includes: performing a first step and a second step a predetermined number of times, wherein the first step includes performing a predetermined number of times: (a1) supplying a first modifying gas to the substrate to form a first modified layer on at least a portion of the substrate; and (a2) supplying a first removal gas to the substrate to remove a portion of the first modified layer from the substrate, and wherein the second step includes performing, after the first step, a predetermined number of times: (b1) supplying a process gas to the substrate to preferentially process an area where the first modified layer is not formed over an area where the first modified layer is present; and (b2) supplying a reactant gas to the substrate.