Protective Package Assembly for Substrate Container Drop Cushioning
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Solution Overview
Problem
Existing substrate container packaging methods fail to effectively protect against large vibrations and drops, as they do not provide sufficient cushioning or shock resistance, leading to potential damage and dust generation during transportation and handling.
Innovation Solution
A protective package assembly comprising a middle package with side buffer boards, an upper package with adjustable upper buffer members, and a lower package with lower buffer members, all made of foamed polyethylene, which creates a combined structure that completely covers the substrate container, allowing for enhanced cushioning and shock resistance by accommodating the irregular contours of the container.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If packaging material covers only edges and corners of substrate container, then it is easy to manufacture and simple in structure, but it cannot provide sufficient protection against large vibrations and drops from height greater than ten centimeters
Solution Approach 1:
The protective package assembly is divided into multiple independent components: a middle package containing the substrate container, an upper package with upper buffer members, and a lower package with lower buffer members. This segmentation allows each component to be optimized for its specific function while maintaining overall protection effectiveness.
Solution Approach 2:
The packaging assembly incorporates buffer members (upper and lower) that are pre-positioned to provide cushioning before impact occurs. These buffer members are designed to absorb and distribute impact forces from drops and vibrations, protecting the substrate container in advance of any harmful events during transportation.
2Object-affected harmful factors
If packaging material covers entire surfaces of substrate container, then it provides better cushioning for small vibrations, but it increases manufacturing complexity and material usage
Solution Approach 1:
The packaging assembly applies different levels of protection to different parts of the substrate container based on their specific vulnerability. The middle package provides comprehensive coverage, while the upper and lower packages focus protection on critical areas, optimizing the distribution of protective qualities rather than applying uniform coverage.
Solution Approach 2:
The packaging structure employs a nested configuration where the substrate container is placed within the middle package, which is then enclosed by the upper and lower packages. This nested arrangement provides multi-layer protection while maintaining manufacturing efficiency through modular assembly.
3Device complexity
If traditional packaging is used for substrate container, then it is simple in structure, but it causes dust generation during transmission and positioning operations
Solution Approach 1:
The protective package assembly merges multiple protective functions into a single integrated system. The middle package, upper package, and lower package work together as a unified assembly that provides both mechanical protection and dust prevention, eliminating the need for separate dust containment measures.
Solution Approach 2:
The buffer members and package structures serve as intermediary elements between the substrate container and the external environment. These intermediaries protect the container from direct contact with dust-generating surfaces during handling and transmission operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The assembly provides greater cushioning forces than traditional designs, effectively protecting the substrate container from drops and vibrations, ensuring safer transportation and handling by distributing impact forces across the surface, edges, and corners.
Implementation Method 1
A protective package assembly includes a middle package, an upper package, and a lower package. The middle package includes a plurality of side buffer boards. The side buffer boards are connected in a ring shape to form an accommodating space communicated with an upper opening and a lower opening. The upper package includes an upper buffer board and a plurality of upper buffer members. The upper buffer board is configured to cover the upper opening. The upper buffer members are distributed at intervals and protrude from a surface of the upper buffer board. The upper buffer members are disposed toward an interior of the accommodating space. The lower package includes a lower buffer board and a plurality of lower buffer members. The lower buffer board is configured to cover the lower opening. The lower buffer members are distributed at intervals and protrude from a surface of the lower buffer board. The lower buffer members are disposed toward the interior of the accommodating space.
Data Source
AI summary
A protective package assembly includes middle, upper, and lower packages. The middle package includes side buffer boards. The side buffer boards are connected in a ring shape to form an accommodating space communicated with upper and lower openings. The upper package includes an upper buffer board and upper buffer members. The upper buffer board is configured to cover the upper opening. The upper buffer members are distributed at intervals and protrude from a surface of the upper buffer board. The upper buffer members are disposed toward the interior of the accommodating space. The lower package includes a lower buffer board and lower buffer members. The lower buffer board is configured to cover the lower opening. The lower buffer members are distributed at intervals and protrude from a surface of the lower buffer board. The lower buffer members are disposed toward the interior of the accommodating space.