Substrate Processing Method for Particle Removal via Peeling and Sublimation
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Solution Overview
Problem
Existing substrate processing methods face challenges in effectively removing particles from substrate surfaces without causing pattern collapse due to high surface tension of rinse liquids and reattachment of particles, leading to low particle removal rates and residual contamination.
Innovation Solution
A substrate processing method involving a first processing liquid with a solute and solvent, where the liquid is heated to form a particle holding layer, then peeled with a peeling liquid, followed by a second processing liquid forming a solid film that is sublimated, avoiding surface tension-induced pattern collapse and reattachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a dissolving processing liquid is supplied to remove particles from the substrate, then particles can be removed from the particle holding layer, but particles may fall off during dissolution and reattach to the substrate, reducing particle removal rate
Solution Approach 1:
The particle holding layer is formed in advance before particle removal, creating a stable structure that captures particles. This preliminary formation of the holding layer ensures particles are secured before any removal actions occur, preventing reattachment during the process.
Solution Approach 2:
The particle holding layer acts as an intermediary between the substrate and the dissolving processing liquid. It allows the liquid to remove particles while the layer itself maintains particle containment, mediating the interaction between the removal agent and the particles to prevent direct reattachment to the substrate.
2Ease of operation
If a rinse liquid with high surface tension is used to wash away the dissolving processing liquid, then the liquid can effectively remove residues, but the surface tension acts on the pattern and causes pattern collapse
Solution Approach 1:
The surface tension parameter of the rinse liquid is changed by selecting a liquid with inherently low surface tension properties. This parameter change allows the rinse liquid to effectively wash away residues without exerting excessive surface tension forces that would cause pattern collapse.
Solution Approach 2:
The low surface tension property, which might be considered a lesser washing capability compared to high surface tension liquids, is converted into a benefit by preventing pattern collapse. The reduced surface tension eliminates the harmful effect of pattern deformation while still providing adequate washing function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves high particle removal rates and prevents pattern collapse, ensuring a clean substrate surface by utilizing a peeling liquid and sublimation to remove particles and residual films without surface tension interference.
Implementation Method 1
supplying a first heat medium to a lower surface of the substrate to heat the first processing liquid on the substrate via the substrate
Implementation Method 2
volatilize at least a portion of the solvent to solidify or cure the first processing liquid
Implementation Method 3
supplying a second heat medium to the lower surface of the substrate to cool the liquid film via the substrate to a temperature not more than a melting point of the sublimable substance
Implementation Method 4
sublimating and thereby removing the solid film from the substrate
Data Source
AI summary
A substrate processing method includes a first processing liquid supplying step of supplying a first processing liquid to an upper surface of the substrate, a holding layer forming step of solidifying or curing the first processing liquid to form a particle holding layer on the upper surface of the substrate, a holding layer removing step of peeling and removing the particle holding layer from the upper surface of the substrate, a liquid film forming step of forming, after removing the particle holding layer from the substrate, a liquid film of the second processing liquid, a solidifying step of cooling the liquid film to a temperature not more than a melting point of the sublimable substance to make the liquid film solidify on the substrate and form a solid film, and a sublimating step of sublimating and thereby removing the solid film from the substrate.