Substrate Patterning With Reusable Raised-Element Etch Mask
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Solution Overview
Problem
The existing photolithography process for creating patterns on a substrate is time-consuming and costly due to the use of resins, solvents, and cleaning solutions, and requires an aggressive cleaning agent that can damage the substrate.
Innovation Solution
A process involving a handle substrate with raised elements is used to etch a thin layer on a substrate of interest, forming patterns without the need for photolithography, by gluing the handle substrate to the substrate, etching sensitive material, and separating them, allowing reuse of the handle substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography process is used to create patterns on substrate, then patterns can be formed with high precision, but the process becomes time-consuming and costly due to multiple steps involving resin, solvents, and cleaning solutions
Solution Approach 1:
The invention extracts and eliminates the photolithography steps (resin application, exposure, development, and stripping) from the patterning process. Instead, it uses a direct stamping method where a handle substrate with pre-formed patterns is bonded to the target substrate, and patterns are transferred through selective etching, thereby removing the time-consuming photolithography sequence while maintaining pattern precision.
Solution Approach 2:
The handle substrate is prepared in advance with the desired pattern structure before being applied to the target substrate. The patterns are pre-formed on the handle substrate through conventional methods, and then this pre-patterned substrate is used to stamp the target substrate, eliminating the need to perform photolithography steps at the time of patterning the target substrate.
2Manufacturing precision
If photolithography process is used to create patterns on substrate, then patterns can be formed with high precision, but the costs increase due to the use of resins, solvents, and cleaning solutions
Solution Approach 1:
The invention removes the consumable photolithography materials (resins, solvents, cleaning solutions) from the process by replacing the chemical-based photolithography method with a physical stamping and etching method. This eliminates the need for these consumable materials while maintaining the ability to form precise patterns on the substrate.
Solution Approach 2:
The handle substrate with pre-formed patterns serves as a reusable template that can be applied multiple times to different target substrates. This replaces the single-use consumable photolithography materials with a durable, reusable stamping substrate, significantly reducing material costs while maintaining pattern precision.
3Reliability
If aggressive cleaning agent is used to remove resin thoroughly, then resin cleaning is effective, but the integrity of substrate surfaces is compromised
Solution Approach 1:
The invention eliminates the need for aggressive cleaning agents by removing the resin-based photolithography process entirely. Instead of using chemicals to strip resin, the method employs a physical stamping approach where patterns are transferred through selective etching, thereby avoiding substrate damage from aggressive cleaning while still achieving thorough removal of unwanted material.
Solution Approach 2:
The handle substrate acts as an intermediary that enables pattern transfer without requiring direct chemical interaction with the target substrate. The selective etching agent etches only the exposed areas of the target substrate while the handle substrate physically protects the areas that should not be etched, eliminating the need for aggressive post-etch cleaning.
4Loss of time
If handle substrate with raised elements is used for etching, then photolithography steps are eliminated and process time is reduced, but the method requires precise alignment and bonding between substrates
Solution Approach 1:
The bonding process creates a fixed, stable relationship between the handle substrate and the target substrate, establishing a precise geometric reference frame. By bonding the substrates together before etching, the method ensures that the raised elements on the handle substrate are perfectly aligned with the corresponding areas on the target substrate, eliminating alignment errors that would occur if the substrates were not bonded.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces process duration and costs by eliminating the need for photolithography steps and allows multiple substrates to be patterned efficiently, with the handle substrate being reusable.
Implementation Method 1
to etch with the etching agent, by wet or gaseous means, to remove the material sensitive to the etching agent present in the first areas
Implementation Method 2
to glue a handle substrate onto a substrate of interest
Data Source
Figure 1A~3
Figure 4A~5C
Figure 6A~7D
AI summary
This description relates to a process comprising the following steps: a) bonding a handle substrate (100) comprising a base (110) and raised elements (120) with a substrate of interest (200) comprising a support substrate (210) covered by a thin layer (220), the thin layer (220) comprising a material sensitive to an etching agent, whereby the thin layer (220) comprises first zones not covered by the raised elements (120) and second zones (Z2) covered by the raised elements (120), b) performing an etch with the etching agent to remove the material sensitive to the etching agent present in the first zones (Z1), the second zones (Z2) being protected during the etch, whereby the thin layer (220) is structured in the form of raised patterns (250), c) separating the handle substrate (100) from the substrate of interest (200).