Substrate Polishing Sequence Using Dual-Diameter Grinding Members

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Solution Overview

Problem

Existing substrate polishing methods and apparatuses face challenges in establishing sufficient polishing conditions efficiently and accurately specifying sensor measurement positions, leading to prolonged processing times.

Innovation Solution

A substrate polishing apparatus and method that utilize a grinding module with two grinding members of different diameters and a control device to perform precise grinding and polishing, along with a polishing table and head rotation angle sensors to specify measurement positions on the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a single polishing pad is used for polishing, then the polishing process is simple, but sufficient polishing conditions cannot be established efficiently and processing time is prolonged

Engineering Contradiction:
Improvepolishing efficiencyVSAvoidprocessing time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The invention divides the polishing process into two distinct stages: a first polishing process using a first polishing pad, and a second polishing process using a second polishing pad. This segmentation allows each polishing pad to be optimized for specific polishing conditions, enabling sufficient polishing conditions to be established efficiently without prolonging the overall processing time.

Inventive Principle:
Principle #1Segmentation

2Measurement precision

If sensor measurement positions are not accurately specified, then the sensor configuration is simple, but polishing control accuracy is insufficient

Engineering Contradiction:
Improvesensor measurement position accuracyVSAvoidsensor configuration complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The invention specifies the measurement positions of sensors provided at the polishing table in advance through the measurement position specifier. By preliminarily determining the optimal measurement positions based on the polishing process requirements, the system achieves accurate polishing control without requiring complex real-time adjustment mechanisms, thus balancing measurement precision with device complexity.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables high-precision polishing by efficiently establishing polishing conditions and accurately specifying sensor measurement positions, reducing processing time and improving substrate flatness.

Implementation Method 1

a first grinding member and a second grinding member with a maximum diameter larger than a maximum diameter of the first grinding member are disposed; a control device controls the grinding module to perform first grinding on part of the processing surface by the first grinding member and second grinding on the processing surface by the second grinding member

Methodology Applied
Scientific EffectAbrasion: Abrasion

Implementation Method 2

a polishing module including a polishing member; and a control device configured to control the grinding module and the polishing module, and the control device controls the grinding module to perform first grinding on part of the processing surface by the first grinding member and second grinding on the processing surface by the second grinding member, and controls the polishing module to perform polishing on the processing surface on which the first grinding and the second grinding have been performed

Methodology Applied
Scientific EffectChemical mechanical polishing:

Data Source

PatentUS20260001189A1Substrate polishing apparatus, substrate polishing method, polishing apparatus, and polishing method
Publication Date: 2026.01.01 EBARA CORP
  • US20260001189A1 patent drawing
  • US20260001189A1 patent drawing
  • US20260001189A1 patent drawing

AI summary

A substrate polishing apparatus is a substrate polishing apparatus configured to perform polishing processing on a processing surface of a substrate and includes: a grinding module in which a first grinding member and a second grinding member with a maximum diameter larger than a maximum diameter of the first grinding member are disposed; a polishing module including a polishing member; and a control device configured to control the grinding module and the polishing module, and the control device controls the grinding module to perform first grinding on part of the processing surface by the first grinding member and second grinding on the processing surface by the second grinding member and controls the polishing module to perform polishing on the processing surface on which the first grinding and the second grinding have been performed.