Dual-diameter grinding stages and preset sensor positions improve substrate polishing accuracy while shortening condition setup and processing time.
A shim matched to the tape edge step gap creates a planar grinding surface, stabilizing wafer backgrinding and preventing cracks.
A liquid ejection ring around a Bernoulli chuck keeps wafer surfaces wet, preserves suction force, and helps remove polishing debris.
Piezoelectric actuators in a CMP pad sense wafer topography and tune local polishing aggressiveness to improve removal uniformity and edge control.
An abrasive belt thread tool automates ball screw super-finishing to deliver consistent surface quality without manual polishing or costly precision machinery.
Multi-sensor ML combines sound, vibration, and temperature data to track belt condition, improving grinding quality and reducing wear.
Cooling and automatic holder rotation keep grinding samples stable, reducing handling errors and improving tensile test reproducibility.
Multiple suction areas and adjustable channel profiles secure small and large workpieces while reducing vacuum loss and setup time.
Hollow platens with a chilled coolant circuit remove scarfing heat evenly while avoiding coolant-dust buildup and reducing manual adjustment.
Pre-shaping a metal belt with transverse curvature enables more uniform grinding, improving thickness consistency and surface smoothness.
By tuning base-sheet roughness and forming a single gamma Zn-Ni plating phase, this case improves hairline clarity, hardness, and corrosion resistance.