Substrate Polishing Electric Field Segmentation

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Solution Overview

Problem

Existing substrate polishing technologies lack the ability to separately control the electric field for different areas of a substrate, which hinders precise control over the polishing process, especially for edge regions.

Innovation Solution

A substrate polishing apparatus and method that includes an electric field applying module with a circular inner electrode and a platen with a rotating polishing pad. The electric field is generated by applying different voltages to multiple electrodes beneath distinct areas of the polishing pad, allowing for independent control of the electric field for each area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a single uniform electric field is applied across the entire polishing pad, then the overall polishing process is simple to control, but the polishing precision and uniformity across different areas (especially edge regions) deteriorates

Engineering Contradiction:
Improvepolishing uniformityVSAvoidelectric field control structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The polishing pad is divided into multiple independent polishing areas (first polishing area, second polishing area, third polishing area), each with its own electrode. This segmentation allows separate electric field control for each area, enabling precise control over polishing uniformity across different regions including edge areas.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different electrodes are configured with different shapes and positions to create locally optimized electric fields. For example, the first electrode has a circular shape for the central area, while the second electrode has an annular shape for the edge region. This local quality approach ensures each area receives the appropriate electric field characteristics for optimal polishing precision.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If multiple separate electrodes are used to control different polishing areas, then the polishing precision for each area is improved, but the device complexity and difficulty of control increases

Engineering Contradiction:
Improvearea-specific polishing controlVSAvoidelectric field control
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

Multiple independent electrodes are merged into a single integrated electrode assembly where all electrodes share common support structures, power connections, and control circuitry. This merging approach maintains the ability to independently control each polishing area while simplifying the overall device structure and ease of operation.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The electrode assembly is designed to perform multiple functions: each electrode can independently generate electric fields for different polishing areas, and the entire assembly can operate as a unified system. The support structure and power supply system serve all electrodes simultaneously, reducing overall complexity while maintaining area-specific control capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables precise control over the polishing process by adjusting the electric field for each area, improving the abrasion state of the substrate, particularly at the edge regions, and enhancing the overall polishing efficiency.

Implementation Method 1

generating an electric field on the polishing pad. The generating the electric field on the polishing pad may include generating an electric field on a polishing location with which the substrate is in contact

Methodology Applied
Scientific EffectElectric field: Electric Field

Data Source

PatentUS12280466B2Substrate polishing apparatus, substrate polishing system including the same, and substrate polishing method using the same
Publication Date: 2025.04.22 SAMSUNG ELECTRONICS CO LTD
  • US12280466B2 patent drawing
  • US12280466B2 patent drawing
  • US12280466B2 patent drawing

AI summary

Disclosed are substrate polishing apparatuses, substrate polishing systems, and/or substrate polishing methods. The substrate polishing apparatus may include an electric field applying module, and a platen that rotates a polishing pad. The electric field applying module may include an inner electrode having a circular shape when viewed in plan. The platen may be on the inner electrode. A central axis of the inner electrode may be spaced apart from a central axis of the platen. The inner electrode may include a first electrode and a second electrode that may surround the first electrode and may have an annular shape.