Substrate Processing Apparatus Selective Position Detection

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Solution Overview

Problem

The existing substrate processing apparatuses face a throughput decrease due to the need for all wafers to pass through a position detector for alignment correction, even when some wafers undergo processes that minimally affect the electrostatic chuck's position, leading to unnecessary position deviation measurements.

Innovation Solution

Implementing a control unit that selectively directs only certain wafers, based on predetermined measurement intervals and process types, to undergo position detection and correction, thereby reducing the number of wafers transferred to the position detector.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If all wafers are measured by the position detector for alignment correction, then manufacturing precision is improved, but productivity deteriorates due to unnecessary measurements of wafers that undergo processes hardly causing position deviation

Engineering Contradiction:

Improvewafer alignment precisionVSAvoidthroughput

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The system changes the measurement parameter from continuous measurement of all wafers to periodic measurement based on a predetermined interval. The control unit determines whether to perform position detection by evaluating process information and comparing it against thresholds, thereby adjusting the measurement frequency dynamically based on process conditions that actually affect alignment.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

Instead of performing position detection on all wafers (excessive action), the system performs partial measurement only on wafers that meet specific criteria. The control unit selectively applies position detection based on process information, performing the measurement only when necessary rather than universally.

Inventive Principle:

Principle #16Partial or excessive action

2Reliability

If position detection is performed for all wafers, then reliability of alignment correction is improved, but loss of time increases due to unnecessary transfers to the position detector

Engineering Contradiction:

Improvealignment correction reliabilityVSAvoidtime for position detection and transfer

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The control unit performs preliminary evaluation of process information before deciding whether to transfer the wafer to the position detector. By assessing process conditions in advance and comparing them against predetermined thresholds, the system determines measurement necessity beforehand, avoiding unnecessary transfers and time loss while maintaining reliability when needed.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS9824861B2Substrate processing apparatus, substrate processing method and recording medium recording substrate processing program

Publication Date: 2017.11.21 TOKYO ELECTRON LTD

AI summary

A substrate processing apparatus includes at least one process module configured to process first substrates. A position detector is configured to detect first positions of the first substrates. A control unit is configured to control the position detector so as to measure a second position of a second substrate selected from the first substrates to be processed in a same process module depending on a measurement interval set for the same process module.