Substrate Processing Apparatus Baffle Plate Gas Flow
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in achieving sufficient film-forming uniformity and efficient gas purging during the film-forming process for large numbers of substrates, leading to suboptimal productivity and a complex, oversized structure.
Innovation Solution
The apparatus features a holder with baffle plates forming separate processing spaces for each substrate, with gas introduction and discharge holes on opposite sides to ensure parallel gas flows and efficient purging, and a double-tube structure to simplify and downsize the processing container, allowing for independent processing spaces and enhanced rotation for uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If process gas is introduced from one end of the reaction tube and discharged from the other end, then the apparatus structure is simple, but film-forming uniformity among substrates is insufficient
Solution Approach 1:
The reaction tube is divided into multiple independent processing zones along the gas flow direction, with each zone handling a specific group of substrates. This segmentation allows different gas flow conditions to be optimized for different substrate positions, improving film-forming uniformity while maintaining a relatively simple overall structure.
Solution Approach 2:
Different regions of the reaction tube are provided with different gas introduction and discharge configurations tailored to local substrate positions. Gas introduction holes and discharge holes are strategically positioned to create appropriate gas flow patterns for each local area, ensuring uniform film formation across all substrates.
2Manufacturing precision
If circular barrier plates are provided inside the reaction tube to prevent gas mixing, then film-forming uniformity is improved, but the apparatus structure becomes complicated and size is enlarged
Solution Approach 1:
The barrier function is extracted from complex circular barrier plates and implemented through the strategic positioning of gas introduction holes and discharge holes in the boat structure. This eliminates the need for additional barrier plates inside the reaction tube, maintaining film-forming uniformity while simplifying the apparatus structure.
Solution Approach 2:
The boat structure serves multiple functions: it holds substrates, provides gas introduction pathways, provides gas discharge pathways, and creates flow separation between different substrate layers. This multi-functionality eliminates the need for separate barrier plates, reducing structural complexity while maintaining processing precision.
3Productivity
If large openings are formed in wafer-holding shelf portions to allow gas flow underneath wafers, then gas purging is improved, but film-forming uniformity deteriorates due to gas mixing
Solution Approach 1:
Gas introduction holes and discharge holes are positioned asymmetrically to create a unidirectional gas flow pattern that moves from the introduction side to the discharge side. This asymmetric configuration allows gas to flow underneath wafers for effective purging while preventing mixing between gas layers, maintaining film-forming uniformity.
Solution Approach 2:
Gas is introduced from one side and discharged from the opposite side in a predetermined flow direction, creating a consistent flow pattern before substrates are processed. This preliminary establishment of flow direction ensures that gas purging and film formation occur under optimized conditions, achieving both high purging efficiency and uniform film formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves sufficient film-forming uniformity among substrates, improves productivity by efficiently purging gases between substrates, and simplifies the apparatus structure while reducing its size.
Implementation Method 1
a heating part that heats the processing container; conducts a predetermined thermal process to the substrates in a process-gas atmosphere under a predetermined temperature and pressure
Implementation Method 2
a gas-introducing part that introduces a process gas into the processing container; gas introduction holes disposed at one lateral side of the respective processing spaces; forming parallel process-gas flows with respect to the substrates
Implementation Method 3
a gas-discharging part that discharges a gas from the processing container to create a predetermined vacuum pressure therein; gas discharge holes disposed at the other lateral side of the respective processing spaces; efficiently purging the gas existing between substrates
Implementation Method 4
the holder is provided with baffle plates each of which forms a processing space for each substrate when the holder is contained in the processing container; separate processing spaces for each substrate; parallel gas flows
Implementation Method 5
absorption amount of process-gas molecules is greater at an area nearer to the introduction side of the process gas; film is formed on a substrate by causing a plurality of kinds of gases to flow independently within a short time and sequentially into the reaction tube
Implementation Method 6
a double-tube structure to simplify and downsize the processing container; simplifies structure and downsizing the apparatus including the processing container
Data Source
AI summary
The present invention is a substrate processing apparatus including: a holder that holds substrates in a tier-like manner; a processing container that contains the holder and that conducts a predetermined thermal process to the substrates in a process-gas atmosphere under a predetermined temperature and pressure; a gas-introducing part that introduces a process gas into the processing container; a gas-discharging part that discharges a gas from the processing container to create a predetermined vacuum pressure therein; and a heating part that heats the processing container; wherein the holder is provided with baffle plates each of which forms a processing space for each substrate when the holder is contained in the processing container; the gas-introducing part is provided with gas introduction holes disposed at one lateral side of the respective processing spaces; and the gas-discharging part is provided with gas discharge holes disposed at the other lateral side of the respective processing spaces, oppositely to the gas introduction holes.