Substrate Processing Apparatus Thermal Displacement Correction
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Solution Overview
Problem
Substrate processing apparatuses face non-uniform processing results due to positional displacement of constituent members caused by temperature changes in the chamber, leading to inconsistent substrate processing outcomes.
Innovation Solution
A substrate processing apparatus with an attaching plate positioned by a first mechanism and a support mechanism positioned oppositely to a reference point, which helps maintain the placing table's alignment and reduces displacement during temperature-induced expansion and contraction, ensuring uniform processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the placing table is fixed to the chamber wall, then the structure is simple, but positional displacement occurs due to temperature-induced expansion and contraction
Solution Approach 1:
The support structure is divided into multiple independent support mechanisms positioned at opposite locations. Each support mechanism independently compensates for thermal expansion/contraction in its local region, preventing cumulative displacement while maintaining overall structural simplicity.
Solution Approach 2:
The patent positions support mechanisms at opposite locations (e.g., 180 degrees apart) to create a balanced support system. When thermal expansion occurs, one support compensates while the other maintains position, effectively counterbalancing the displacement forces and maintaining positioning accuracy.
2Measurement precision
If positioning pins are used to fix the placing table, then positioning is achieved, but thermal expansion causes displacement from the reference position
Solution Approach 1:
The support mechanisms are designed to dynamically adjust their position in response to thermal expansion and contraction. Rather than rigidly fixing the placing table, the supports move with the thermal cycles, maintaining constant positioning precision while accommodating dimensional changes in the chamber structure.
Solution Approach 2:
The patent allows the support mechanisms to change their positional parameters (location, height) in response to temperature changes. This dynamic parameter adjustment compensates for thermal expansion/contraction, maintaining stable positioning precision despite environmental parameter changes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses positional displacement of the placing table, thereby enhancing the in-plane uniformity and symmetry of substrate processing, ensuring consistent results across the substrate.
Implementation Method 1
a first positioning mechanism in a direction in which the processing chamber extends and contracts due to expansion and contraction caused by temperature changes
Data Source
AI summary
There is provided a substrate processing apparatus. The apparatus comprises: a processing chamber; an attaching plate attached to the processing chamber while being positioned by a first positioning mechanism in a direction in which the processing chamber extends and contracts due to expansion and contraction caused by temperature changes with respect to a predetermined reference position serving as a reference for measuring positional displacement in the processing chamber; and a placing table configured to place a substrate thereon and disposed in the processing chamber via a support mechanism attached to the attaching plate, the support mechanism being positioned by a second positioning mechanism at a position opposite to a position of the first positioning mechanism with respect to the reference position.