Substrate Processing Device Heat Hole Uniformity
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Solution Overview
Problem
Existing substrate processing devices face challenges in achieving uniform processing of multiple substrates due to non-uniform distribution of raw materials and plasma, leading to variations in thin membrane thickness and electrical characteristics, which reduces yield and processing quality.
Innovation Solution
A substrate processing device with a disk part and pocket part configuration, where the pocket part is designed with a heat hole for improved heat transfer and can be rotated for uniform plasma processing, and includes a gear system for controlled heat distribution and electrical connection to ensure uniform processing across all substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple substrates are arranged on one plate for batch processing, then processing efficiency is improved, but uniformity of processing state deteriorates due to non-uniform raw material distribution and temperature
Solution Approach 1:
The patent applies local quality by providing individual heating means for each pocket part and enabling independent temperature control of each substrate position. The pocket parts can be heated to different temperatures based on their specific requirements, allowing uniform processing across multiple substrates despite their different positions on the plate.
Solution Approach 2:
The patent implements dynamics by making the pocket parts rotatable on the disk part. This rotation allows each pocket part to pass through different regions of the chamber (including regions with different raw material concentrations and plasma densities), enabling dynamic adjustment of processing conditions to achieve uniform thin membrane thickness across all substrates.
2Productivity
If raw material is concentrated on the center region of the plate, then deposition rate is improved, but thin membrane thickness uniformity deteriorates
Solution Approach 1:
The pocket parts are designed to rotate on the disk part, allowing them to dynamically move through different radial positions of the chamber. This rotation enables each substrate to experience varying raw material concentrations during the deposition process, balancing the overall deposition rate while achieving uniform thin membrane thickness across all substrates.
Solution Approach 2:
The rotation of pocket parts creates periodic exposure to different raw material concentration zones. Each pocket part periodically passes through the center region (high raw material concentration) and edge regions (lower raw material concentration), achieving an averaged uniform deposition rate and thin membrane thickness.
3Temperature
If heating means is provided for substrate processing, then processing temperature is improved, but heat transfer efficiency to pocket part deteriorates
Solution Approach 1:
The disk part serves as an intermediary heat transfer medium. The heating means heats the disk part, which then conducts heat to the pocket parts. This intermediary approach improves heat transfer efficiency compared to direct heating of each pocket part, while still achieving the required processing temperatures.
Solution Approach 2:
The patent provides individual heating means for each pocket part in addition to the overall heating system. This localized heating capability ensures that each pocket part receives sufficient heat directly, compensating for any heat loss during transfer through the disk part, and maintaining optimal processing temperature for each substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat transfer efficiency and plasma processing uniformity, resulting in consistent thin membrane thickness and improved yield by adjusting heat distribution and electrical connectivity, addressing the non-uniformity issues in existing technologies.
Implementation Method 1
a pocket part-installed surface of the disk part may have a heat hole through which heat generated by the heating means passes
Implementation Method 2
In the processing such as depositing, etching, etc. using plasma, the pocket part to which the substrate is loaded needs to be electrically connected to the outside space of the chamber
Data Source
AI summary
A substrate processing device according to an embodiment of the present invention includes a disk part disposed in a chamber in which a heating means is provided, and a pocket part installed on one surface of the disk part and on which a substrate is seated. A heat hole through which heat generated by the heating means passes may be formed on an installation surface of the disk part on which the pocket part is installed, or a gear hole through which the heat of the heating means passes may be formed in a pocket gear facing the disk part.