Substrate Processing Apparatus Liquid Suction Peel
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Solution Overview
Problem
Conventional semiconductor fabrication processes incur high production costs due to excessive chemical agent consumption and the need for precise, costly, and electricity-consuming instruments to remove temporary substrates.
Innovation Solution
A substrate processing apparatus utilizing a liquid supply unit to create a suction force between the temporary substrate and the semiconductor device, leveraging the Bernoulli and capillary effects to separate them efficiently without the need for large chemical solutions or expensive instruments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wet etching is used to remove the temporary substrate, then the temporary substrate can be completely removed, but a large amount of wet etching agent is consumed, increasing production costs
Solution Approach 1:
The patent extracts the temporary substrate removal function from conventional wet etching processes. By introducing a release layer with selective solubility, the temporary substrate can be removed separately from the semiconductor device without requiring aggressive chemical etching agents, thus reducing chemical consumption while maintaining complete removal
Solution Approach 2:
The release layer acts as an intermediary between the temporary substrate and the semiconductor device. This intermediate layer enables selective removal of the temporary substrate through its unique solubility properties, allowing removal without direct contact between etching agents and the semiconductor device, thereby reducing chemical agent consumption and waste
2Reliability
If grinding is used to remove the temporary substrate, then the temporary substrate can be completely removed, but the fabrication process becomes time-consuming
Solution Approach 1:
The patent changes the removal mechanism from mechanical grinding to chemical dissolution by selecting a release layer with specific solubility characteristics. This parameter change allows the temporary substrate to be removed through selective dissolution rather than time-consuming mechanical grinding, significantly reducing fabrication time while maintaining complete removal
Solution Approach 2:
The release layer enables periodic or staged removal of the temporary substrate. By controlling the dissolution process through selective chemical treatment, the temporary substrate can be removed in a controlled manner without requiring prolonged continuous grinding operations, thus reducing overall process time
3Reliability
If laser stripping is used to remove the temporary substrate, then the temporary substrate can be removed, but expensive and electricity-consuming apparatuses are required, and the semiconductor structure may be damaged
Solution Approach 1:
The patent replaces the mechanical/optical laser stripping system with a chemical dissolution approach. By using a release layer that dissolves selectively in specific solvents, the complex and expensive laser apparatus is substituted with simple chemical treatment processes, reducing equipment costs and complexity while avoiding damage to the semiconductor structure
Solution Approach 2:
The release layer acts as a disposable intermediate layer that is consumed during the removal process. This cheap, sacrificial layer eliminates the need for expensive laser equipment, as the removal function is achieved through the consumable release layer rather than through costly reusable laser apparatus
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs by eliminating the need for extensive chemical usage and costly equipment, while providing an effective and efficient method for substrate separation and enhanced cleaning capabilities.
Implementation Method 1
a suction force is generated on the second surface when a liquid supplied from a liquid supply unit flows at the second surface to generate a peel force between the temporary substrate and the semiconductor device
Implementation Method 2
a suction force is generated on the second surface when a liquid supplied from a liquid supply unit flows at the second surface to generate a peel force between the temporary substrate and the semiconductor device
Data Source
AI summary
A substrate processing apparatus for processing a wafer including a temporary substrate and a semiconductor device. The substrate processing apparatus includes a first half portion, a second half portion and a liquid supply unit. The first half portion includes a working platform. The second half portion includes an upper cover having a first surface and a plurality of second holes. The liquid supply unit provides a liquid. The wafer is placed on the working platform, and a second surface of the semiconductor device and the first surface are spaced by a distance sufficient for allowing the liquid to come into contact with the first surface when the liquid flows at the second surface to generate a suction force on the second surface. As such, a peel force is formed between the temporary substrate and the semiconductor device to cause the two to separate from each other.