Substrate Processing Apparatus Redundant Modules
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Solution Overview
Problem
Existing substrate processing apparatuses for manufacturing Magnetoresistive Random Access Memory (MRAM) devices face issues with process interruptions and increased substrate wastage due to processing module breakdowns, leading to decreased throughput and increased costs.
Innovation Solution
A substrate processing apparatus with multiple process modules and transfer devices arranged in a vacuum atmosphere, allowing for continuous processing by switching to standby modules when a module is unavailable, and a control unit to manage substrate transfer and processing without interrupting operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple processing chambers are provided for forming laminated films, then the device can perform complete processing sequences, but the complexity of the device increases and the cost rises
Solution Approach 1:
The device is divided into multiple independent processing chambers (first processing chamber, second processing chamber, third processing chamber) that can operate independently. Each chamber can perform specific processing steps, and the system can switch between chambers to maintain processing continuity when one chamber is unavailable, thus improving reliability without requiring a single overly complex chamber.
Solution Approach 2:
The system changes the operational state parameters of different chambers by introducing a standby mode. The standby processing chamber maintains readiness without active processing, allowing the system to switch chambers based on operational needs. This parameter change enables processing continuity while managing device complexity through controlled standby states.
2Productivity
If the device operates continuously with multiple substrates, then throughput increases, but the risk of substrate wastage due to chamber breakdown increases
Solution Approach 1:
A standby processing chamber is prepared in advance and maintained in a ready state before actual processing failures occur. This preliminary preparation ensures that when a primary processing chamber breaks down during continuous operation, substrates can be immediately transferred to the standby chamber without interruption, preventing substrate wastage while maintaining high throughput.
Solution Approach 2:
The system incorporates a standby processing chamber as a buffer or cushion against potential failures. This redundant chamber acts as a protective measure that absorbs the impact of chamber breakdowns, ensuring that ongoing substrate processing can continue uninterrupted, thereby reducing substrate wastage while maintaining productivity.
3Reliability
If a standby processing chamber is provided, then processing can continue when a chamber breaks down, but the device complexity and initial cost increase
Solution Approach 1:
The processing system is segmented into multiple independent chambers (first, second, and third processing chambers) with at least one designated as standby. This segmentation allows the standby chamber to be integrated into the existing device architecture without requiring a complete system redesign, thereby improving reliability while minimizing the increase in device complexity.
4Reliability
If substrates are transferred through multiple chambers in sequence, then complete processing can be achieved, but processing time increases when switching chambers due to breakdowns
Solution Approach 1:
The standby processing chamber is preliminarily prepared and maintained in a ready state with all necessary processing capabilities pre-configured. When a chamber breakdown occurs during substrate processing, the substrate can be immediately transferred to the pre-prepared standby chamber without requiring setup or configuration time, thus maintaining processing completeness while minimizing additional processing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables continuous processing without substrate wastage, reduces downtime, and maintains high throughput by ensuring that substrate processing can be completed using alternative modules, thereby minimizing the number of discarded substrates and maintaining operational efficiency.
Implementation Method 1
The metal films are formed mainly by sputtering
Implementation Method 2
the metal oxide film is formed, for example, by forming a metal film by a sputtering device and then oxidizing the metal film with oxygen radicals by another device
Data Source
AI summary
An apparatus includes a row of substrate transfer devices 3 which can deliver a wafer W within a transfer chamber; and rows of process modules PM, arranged at right and left sides of the row of the substrate transfer devices along the row, configured to perform processes to the wafer W. The rows of the process modules PM are arranged such that each of the processes can be performed by at least two process modules PM. Thus, when a single process module PM cannot be used, the wafer W can be rapidly transferred to another process module PM which can perform the same process as performed in the corresponding process module. Therefore, even when the single process module PM cannot be used, the processes can be continued to the wafers W without stopping an operation of the apparatus, so that the number of wasted wafers W can be reduced.