Substrate Processing System Thickness Measurement Segmentation
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Solution Overview
Problem
The existing substrate processing systems face a decrease in throughput due to the long work time at the second grinding position, where both grinding and thickness measurement are performed, leading to inefficiencies in wafer processing.
Innovation Solution
A substrate processing system is introduced that includes separate first and second thickness measuring apparatuses to measure the thickness of the substrate before and after grinding, respectively, allowing for independent measurement and adjustment of the substrate's inclination, thereby improving processing efficiency and throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If thickness measurement is performed at the second grinding position, then the thickness of the wafer can be measured after grinding, but the work time at the second grinding position increases and throughput decreases
Solution Approach 1:
The patent divides the thickness measurement function into two separate locations: a first thickness measuring apparatus measures the thickness before grinding, and a second thickness measuring apparatus measures the thickness after grinding. This segmentation allows the measurement processes to be distributed across different positions, enabling parallel processing and reducing the work time at the second grinding position, thereby improving throughput while maintaining measurement precision.
2Manufacturing precision
If the chuck table is tilted to adjust wafer inclination, then the thickness uniformity can be improved, but the processing time increases due to repeated measurement and adjustment cycles
Solution Approach 1:
The patent performs preliminary thickness measurement at the first thickness measuring apparatus before the grinding process. This preliminary measurement data is used to pre-adjust the chuck table inclination, so that when the wafer reaches the second grinding position, the inclination is already optimized. This eliminates the need for repeated measurement and adjustment cycles, reducing processing time while maintaining thickness uniformity.
Solution Approach 2:
The patent implements a feedback mechanism where the thickness measurement data from both the first and second thickness measuring apparatuses is used to control and adjust the chuck table inclination. The control unit receives measurement data and automatically adjusts the inclination angle to achieve optimal thickness uniformity, reducing manual intervention and repeated adjustment cycles.
Data Source
AI summary
A substrate processing system configured to process a combined substrate in which a first substrate and a second substrate are bonded to each other includes a processing apparatus configured to grind the first substrate; a first thickness measuring apparatus configured to measure a thickness of the first substrate before being ground by the processing apparatus and a total thickness of the combined substrate including the first substrate; and a second thickness measuring apparatus configured to measure the thickness of the first substrate after being ground by the processing apparatus.