Substrate Puddle Development With Stage-Specific Exhaust Pressure
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Solution Overview
Problem
Conventional substrate treating apparatuses experience issues with incomplete development on the front surface of substrates during the puddle process due to continuous exhaust, leading to localized empty spaces where development does not occur.
Innovation Solution
A substrate treating method and apparatus that control exhaust pressure during the puddle process to ensure complete development, involving the formation of a liquid film on a rotating substrate, followed by puddling with reduced exhaust pressure, and subsequent rinsing with increased exhaust pressure, repeated multiple times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If continuous exhaust is provided during the puddle process, then fume removal is effective, but the front surface of the substrate is not wetted and local empty spaces occur
Solution Approach 1:
The exhaust system operates periodically rather than continuously. During the puddle process, exhaust is temporarily stopped to maintain proper wetting conditions, then resumed for fume removal. This periodic operation allows the treating liquid to adequately react with the thin film while still achieving effective fume removal at appropriate times.
Solution Approach 2:
The exhaust pressure is dynamically adjusted based on the process stage. The system transitions from continuous exhaust during liquid film formation to reduced or stopped exhaust during the puddle process, then increases exhaust during rinsing. This dynamic control allows optimization of both wetting and fume removal at different stages.
2Manufacturing precision
If exhaust pressure is reduced during puddling, then liquid film reaction is improved, but fume removal efficiency decreases
Solution Approach 1:
The exhaust system operates periodically rather than continuously. During the puddle process, exhaust is temporarily stopped to maintain proper wetting conditions, then resumed for fume removal. This periodic operation allows the treating liquid to adequately react with the thin film while still achieving effective fume removal at appropriate times.
Solution Approach 2:
The useful action of fume removal continues through the overall process by resuming exhaust operation during the rinsing stage. While exhaust is reduced during puddling to enable proper chemical reaction, the system maintains the capability for continuous fume removal by restarting the exhaust pump after the puddle process completes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method and apparatus effectively prevent localized incomplete development on substrate edges by optimizing exhaust pressure control, ensuring thorough treatment and rinsing, thereby improving the quality of substrate processing.
Implementation Method 1
reacting a thin film on the substrate with the liquid film on the substrate
Implementation Method 2
forming a liquid film of a treating liquid on the substrate by supplying the treating liquid to a rotating substrate
Implementation Method 3
an exhaust pressure provided at the treating space during the puddling is lower than an exhaust pressure provided at the treating space during the forming of the liquid film
Data Source
AI summary
The inventive concept provides a substrate treating method on which there is no generation of a portion on which a development is not performed, among a front surface of a substrate during a puddle process. The substrate treating method includes positioning a substrate in a treating space; forming a liquid film of a treating liquid on the substrate by supplying the treating liquid to a rotating substrate; and puddling including stopping the supplying of the treating liquid and reacting a thin film on the substrate with the liquid film on the substrate, and wherein an exhaust pressure provided at the treating space during the puddling is lower than an exhaust pressure provided at the treating space during the forming of the liquid film.