Substrate Recess Layout for Accurate Electronic Unit Mass Transfer
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Solution Overview
Problem
Conventional electronic device manufacturing methods face issues with orderly disposition and electrical connectivity of electronic units during mass transfer, leading to abnormal distribution and reduced product yield.
Innovation Solution
A method involving a substrate structure with recesses, where each recess has a larger first portion and a smaller second portion, allowing for precise placement of electronic units using fluid transfer and detection, with the ability to reposition units in the second portion if initially misplaced.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fluid transfer process is used to massively transfer electronic units, then productivity is improved, but manufacturing precision deteriorates due to abnormal distribution and disordered placement
Solution Approach 1:
The recess is divided into two portions: a first portion for receiving electronic units during mass transfer and a second portion for precise positioning. This segmentation allows the system to benefit from both high-speed fluid transfer and accurate placement, resolving the contradiction between productivity and manufacturing precision.
Solution Approach 2:
The first portion of the recess acts as an intermediary zone that temporarily holds electronic units transferred by fluid, allowing them to be gently deposited without direct impact on the final positioning location. This intermediary structure enables smooth transition from mass transfer to precise placement.
2Ease of operation
If electronic units are disposed in first portion of recess, then ease of operation is improved for mass transfer, but reliability deteriorates due to abnormal electrical connection
Solution Approach 1:
By dividing the recess into first and second portions, the system separates the mass transfer function (first portion) from the reliable connection function (second portion). Electronic units are transferred to the first portion where handling is easy, then moved to the second portion where proper electrical connection is ensured.
Solution Approach 2:
The detection step is performed preliminarily to identify electronic units in the first portion that should be in the second portion. This preliminary detection enables subsequent corrective positioning to ensure proper electrical connection before final assembly.
3Manufacturing precision
If detection and positioning steps are added to correct misplaced units, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The system uses automated detection and positioning mechanisms that self-correct misplaced electronic units without requiring manual intervention. The detection device automatically identifies units in the first portion and the positioning mechanism moves them to the second portion, making the complexity management automatic rather than manual.
Solution Approach 2:
The detection device likely uses optical detection methods where electronic units are identified and located through light reflection or absorption differences. This non-contact detection method enables precise identification of unit positions without adding mechanical complexity to the transfer system.
Data Source
AI summary
A method for manufacturing an electronic device includes following steps: providing a substrate structure having a plurality of recesses, wherein each of the plurality of recesses has a first portion and a second portion connected to the first portion, and an area of the first portion is greater than an area of the second portion; providing a plurality of electronic units to the plurality of recesses; detecting a location of at least one of the plurality of electronic units, so as to determine whether the at least one of the plurality of electronic units is disposed in one of the second portions of the plurality of recesses; and positioning the at least one of the plurality of electronic units in the one of the second portions of the plurality of recesses when the at least one of the plurality of electronic units is disposed in a defective location.