Substrate With Recessed Slots For Vertically Assembled Semiconductor Dies
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Solution Overview
Problem
The challenge in semiconductor device assembly is the stress caused by thinning processes, which can lead to irreparable damage to dies, particularly in stacked semiconductor device assemblies, resulting in design failures and increased manufacturing costs due to the fragility of through-silicon vias (TSVs) and the complexity of connecting multiple dies.
Innovation Solution
A substrate with recessed slots is used to vertically assemble semiconductor dies, allowing direct coupling to the substrate without the need for TSVs at the dies, reducing stress and manufacturing complexity by using solder joints or conductive films for electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-silicon vias (TSVs) are used to connect multiple dies in stacked assemblies, then electrical connectivity between dies is achieved, but the fragility of TSVs causes stress and damage during thinning processes
Solution Approach 1:
The patent extracts the TSV structure from the die and relocates it to the substrate. The substrate now contains the TSVs that extend through it to contact pads, while the dies are thinned to expose their contact pads for direct connection to the substrate contacts, eliminating the need for fragile TSVs within the dies themselves.
Solution Approach 2:
The substrate acts as an intermediary structure that provides mechanical support and electrical connectivity. It contains the TSVs and contact pads that interface with the die contact pads, serving as a robust intermediary that protects the connection process and eliminates the need for fragile within-die TSVs.
2Adaptability or versatility
If multiple dies are stacked vertically to increase circuit density, then device functionality is improved, but the complexity of connecting multiple dies increases manufacturing difficulty
Solution Approach 1:
The patent segments the TSV structure into the substrate domain rather than distributing TSVs across multiple dies. Each die only needs simple contact pads on its back surface, while all the complex TSV routing and connectivity is segmented into the substrate layer, simplifying the die fabrication process.
Solution Approach 2:
The patent merges the electrical connectivity function and mechanical support function into the substrate structure. The substrate combines TSV routing, contact pad provision, and structural support into a single integrated component, reducing the overall system complexity despite having multiple dies.
3Length of moving object
If dies are thinned to reduce vertical thickness, then spatial constraints are satisfied, but stress from thinning processes causes irreparable damage to fragile TSVs
Solution Approach 1:
The patent extracts the TSV structure from the die and places it in the substrate. This allows the die to be thinned without the TSVs present in the die structure, eliminating the risk of TSV damage during thinning while still maintaining electrical connectivity through the substrate's TSVs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a robust and cost-efficient semiconductor device assembly by eliminating the need for fragile TSVs at the dies, preventing damage during the thinning process and simplifying the manufacturing process, thereby reducing costs and improving assembly reliability.
Implementation Method 1
contact pads that electrically couple to contact pads located on the dies when the dies are vertically assembled at the recessed slots
Data Source
AI summary
This document discloses techniques, apparatuses, and systems for providing a semiconductor device assembly with a substrate for vertically assembled semiconductor dies. A semiconductor assembly is described that includes a semiconductor die coupled to a substrate such that an active surface of the semiconductor die is substantially orthogonal to a top surface of the substrate. The substrate includes a surface having a recessed slot at which a side surface of the semiconductor die couples. The semiconductor die includes a contact pad that couples to a contact pad at the recessed slot. In doing so, the techniques, apparatuses, and systems herein enable a robust and cost-efficient semiconductor device to be assembled.