Substrate Reinforcing Layout for Chip Crack Prevention
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Solution Overview
Problem
Conventional packaging substrates face issues with poor adhesion and stress dispersion due to small contact areas between reinforcing portions and the substrate body, leading to potential falling off and cracking of semiconductor chips.
Innovation Solution
A substrate structure with reinforcing portions featuring dummy pads and trace lines connected to them, increasing the contact area and stress dispersion, including designs with curved or angled line segments to enhance adhesion and prevent cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If reinforcing portions are designed as dummy pad structures without electrical connection, then the substrate structural strength is enhanced, but the contact area between reinforcing portions and substrate body becomes extremely small, resulting in poor adhesion
Solution Approach 1:
The patent extends the reinforcing portions from simple pad structures to include trace lines that connect the pads to the substrate body in a planar configuration. This dimensional extension significantly increases the contact area between the reinforcing portions and the substrate body, thereby improving adhesion while maintaining the dummy pad structure without electrical connection.
2Device complexity
If reinforcing portions have small contact areas with substrate body, then the substrate structure remains simple, but stress dispersion capability is insufficient, causing semiconductor chips to crack
Solution Approach 1:
By adding trace lines that extend from the dummy pads across the substrate surface, the reinforcing portions achieve much larger contact areas with the substrate body. This planar extension provides effective stress dispersion pathways, preventing semiconductor chip cracking while maintaining relative structural simplicity.
Solution Approach 2:
The reinforcing portions are segmented into multiple components: dummy pads positioned at critical locations and trace lines connecting them to the substrate body. This segmentation allows the structure to disperse stress across multiple contact points and pathways, enhancing chip crack resistance without excessive complexity.
Data Source
AI summary
An electronic package is provided and includes a substrate structure and an electronic element disposed on the substrate structure. The substrate structure is provided with a plurality of circuits and a reinforcing portion that is free from being electrically connected to the plurality of circuits on a surface of a substrate body of the substrate structure, such that the electronic element is electrically connected to the plurality of circuits and is free from being electrically connected to the reinforcing portion, and the reinforcing portion includes a dummy pad and a trace line connected to the dummy pad to increase a layout area of the reinforcing portion on the substrate body. Therefore, the adhesion of the reinforcing portion can be improved, and the electronic element can be prevented from cracking.