Substrate With Rear-Surface Retainer for Heat Sink Fixation
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Solution Overview
Problem
The existing methods for heat dissipation from heat-generating components on circuit boards require multiple insertion holes for screws, which reduces the area available for wiring and can cause interference with electronic device attachments.
Innovation Solution
A substrate design that includes a reinforcement member with screw holes only on the rear surface, allowing the heat sink to be attached using screws that do not penetrate the heat dissipation member, thereby reducing the number of holes needed in the circuit board and minimizing interference with other components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple insertion holes are provided in the circuit board for heat sink attachment, then the heat sink can be securely fixed to the heat generator, but the area available for wiring patterns is reduced and interference with electronic device attachments occurs
Solution Approach 1:
The attachment structure is segmented into three distinct components: the circuit board, the reinforcement member with screw holes, and the heat sink. The reinforcement member acts as an intermediate component that carries the screw holes, separating the wiring area (on the circuit board) from the fixation points (on the reinforcement member), thereby resolving the conflict between secure fixation and wiring space availability
Solution Approach 2:
The reinforcement member serves as an intermediary component between the circuit board and the heat sink. It provides the necessary screw holes for secure heat sink attachment while being attached to the circuit board at locations that do not interfere with the wiring patterns, thus mediating between the conflicting requirements of fixation stability and wiring area
2Reliability
If multiple insertion holes are provided in the circuit board for heat sink attachment, then the heat sink can be securely fixed to the heat generator, but deformation of the circuit board is caused
Solution Approach 1:
The fixation function is segmented from the circuit board structure and assigned to a separate reinforcement member. This prevents the circuit board from being directly compromised by screw holes and attachment forces, maintaining its structural integrity and stability while still enabling secure heat sink fixation through the reinforcement member
Solution Approach 2:
The reinforcement member acts as a mediator that absorbs the mechanical stress and deformation caused by heat sink attachment. By providing attachment points away from the circuit board's critical wiring areas and structural zones, it prevents circuit board deformation while ensuring reliable heat sink fixation
3Ease of manufacture
If screw holes are provided on the front surface of the heat dissipation member, then the heat sink can be attached to the heat generator, but interference with attachment of electronic devices occurs
Solution Approach 1:
The screw holes are relocated from the front surface (one dimension) to the rear surface (another dimension) of the reinforcement member. This spatial repositioning allows the heat sink attachment to occur without interfering with the front surface operations of electronic device attachment, resolving the conflict between manufacturing ease and device compatibility
Solution Approach 2:
Instead of providing screw holes on the front surface of the heat dissipation member as in conventional designs, the invention inverts the approach by placing the screw holes on the rear surface of the reinforcement member. This inverted configuration enables heat sink attachment while preserving the front surface for electronic device operations, eliminating interference
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for more efficient heat dissipation while maintaining a higher density of wiring patterns and reducing deformation of the circuit board, enabling better attachment and functionality within electronic devices.
Implementation Method 1
a fastener configured to fix the heat sink to the retainer so as to bring the heat sink member into contact with the heat generator
Implementation Method 2
a heat conducting sheet which is composed of a heat-conducting flexible rubber-like elastic body and includes a sheet-like thermal connection section interposed between an IC chip that generates heat and a heat sink
Data Source
AI summary
A substrate includes a circuit board, a heat generator mounted over a mounting surface of the circuit board, a heat sink in contact with the heat generator, a retainer attached to the mounting surface so as to retain the heat generator and reinforce the circuit board, and a fastener configured to fix the heat sink to the retainer so as to bring the heat sink into contact with the heat generator.