Non-Contact Substrate Reversing for Thin Wafer Handling
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Solution Overview
Problem
Existing substrate treating apparatuses struggle to suitably reverse thinner and larger diameter substrates, leading to potential damage or breakage during the reversing process.
Innovation Solution
A substrate treating apparatus and method utilizing a transport mechanism with a first suction portion that sucks the substrate without contact and a reversing mechanism with a second suction portion that rotates around a horizontal axis to support and reverse the substrate non-contactually, ensuring safe handling and positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional contact-based substrate handling is used, then mechanical support is provided, but substrate damage or breakage occurs during reversing
Solution Approach 1:
The patent replaces conventional mechanical contact-based substrate handling with a non-contact suction-based system. The substrate is held and reversed using suction forces applied to the top surface, eliminating mechanical contact points that cause stress concentration and damage to thin, large-diameter substrates.
Solution Approach 2:
The invention uses pneumatic suction through a suction portion to hold and manipulate the substrate. Gas flow is directed along the top face of the substrate to create suction pressure, enabling contactless handling during the reversing operation. This pneumatic approach distributes force uniformly across the substrate surface, preventing localized stress and damage.
2Adaptability or versatility
If substrate thickness is reduced and diameter is increased, then substrate performance is improved, but bending amount increases making reversing difficult
Solution Approach 1:
The patent addresses the rigidity issue by changing the handling approach from edge-based mechanical support to surface-based pneumatic suction. By applying suction force distributed across the top surface area rather than concentrating support at edges or specific points, the system can safely handle thin, large-diameter substrates without causing bending or damage during reversing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the safe and suitable inversion of thin, large-diameter substrates by minimizing contact and reducing mechanical stress, thereby preventing damage or breakage.
Implementation Method 1
the first suction portion is located above the substrate and sucks the substrate upward while causing gas to flow along a top face of the substrate
Implementation Method 2
the second suction portion is located above the substrate supported by the supporting portion and sucks the substrate upward while causing gas to flow along a top face of the substrate
Data Source
AI summary
A substrate treating apparatus and a substrate reversing method. The substrate treating apparatus includes a supporting portion, a transport mechanism, and a reversing mechanism. The transport mechanism includes a first suction portion and a hand driving unit. The reversing mechanism includes a second suction portion and a rotation driving unit. When the transport mechanism transports a substrate to the supporting portion, the first suction portion is located above the substrate and sucks the substrate upward while causing gas to flow along a top face of the substrate, and the hand driving unit moves the first suction portion to the supporting portion. When the reversing mechanism receives the substrate from the supporting portion, the second suction portion is located above the substrate-supported by the supporting portion and sucks the substrate upward while causing gas to flow along the top face of the substrate.