Gripping Heads TRIZ Cases
- Substrate End-Effector With Floating Clamp for Precise Alignment
A floating clamping body guided by springs and vacuum fixation adapts to substrate eccentricity for precise alignment with less heat and complexity.
- Carrier Tape Placement Alignment Using Vision Feedback
Camera-based feedback corrects device size and orientation during carrier tape placement, reducing misalignment, jamming, and yield loss.
- Substrate Transfer Sensor Layout for Transparent Wafer Detection
A reflection-type detector with a partitioned projector and receiver improves transparent substrate detection in narrow multi-stage holders.
- Non-Contact Substrate Reversing for Thin Wafer Handling
Gas-flow suction and horizontal-axis rotation reverse thin, large-diameter substrates without contact, reducing bending stress and breakage.
- Segmented Magnetic Coupling With Switchable Flux Control
Segmented pole portions, movable magnets, and sensors let one coupling adapt to multiple ferromagnetic interfaces and field strengths.
- Harness Isolation Plate Suction Assembly for Damage-Free Handling
Negative-pressure suction avoids weak harness regions and spreads lifting force for damage-free battery pack isolation plate assembly.
- Miniature Fiber Optic Coupler for Swappable End Effector Arms
A prism-based miniature coupler lets embedded wafer-handling fibers disconnect quickly, cutting end effector swap time and realignment effort.
- Fiber Electrode Electrostatic Gripper for Soft Object Handling
A fabric-based electrode and tuned soft polymer layers improve electrostatic grip on curved soft objects while resisting kinks and repeated wear.
- Conveyance Hand Attraction Pad Layout for Warped Object Handling
A dual-pad conveyance hand balances strong hold and low thickness to stabilize warped object transfer and limit air inflow into suction spaces.
- Batch Wafer Cleaning with Rotating Transfer for Etch Uniformity
Periodic wafer rotation during batch wet cleaning evens chemical flow, limits by-product buildup, and improves etch uniformity.
- Robot Tire Mounting on Rims With Coordinated Assembly Motion
A single handling robot grips, lubricates, and positions tires while coordinating with the assembly head to cut devices, maintenance, and cycle time.
- Wafer Transfer Blade Linkage for Fine Interval Alignment
Parallel linkage and fine-adjustment mechanisms correct blade spacing and tilt deviations to improve multi-wafer transfer efficiency.
- Carrier-Free Wafer Transfer in CVD Vapor Deposition
Dual-recess robot blades and load-lock holders let wafers move with or without carriers, avoiding CVD downtime from broken rings.