Wafer Transfer Blade Linkage for Fine Interval Alignment
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Solution Overview
Problem
Conventional wafer transfer systems face issues with minute inclination differences and deviations in blade intervals, leading to inefficiencies in substrate handling.
Innovation Solution
A blade interval adjusting device with a guide mechanism and linkage mechanism to adjust blade intervals, utilizing an interval fine-adjustment mechanism for precise alignment of blades.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If blades are arranged side by side to transfer multiple wafers simultaneously, then productivity is improved, but manufacturing precision deteriorates due to minute inclination differences and blade interval deviations
Solution Approach 1:
The patent implements adjustable blade intervals through a mechanism that allows the blade holding portion to change its configuration dynamically. The blade interval adjusting mechanism enables the distance between adjacent blades to be modified, transforming a static structure into a dynamic one that can adapt to different precision requirements while maintaining high productivity.
2Manufacturing precision
If blade intervals are adjusted to compensate for inclination differences, then manufacturing precision is improved, but device complexity increases due to additional adjustment mechanisms
Solution Approach 1:
The blade holding portion is divided into multiple independently adjustable blade holding positions. Each position can be adjusted separately to compensate for inclination differences, allowing precise control of individual blade intervals without requiring complex overall restructuring of the entire blade assembly.
Solution Approach 2:
The adjustable blade interval mechanism introduces dynamic adaptability to the blade assembly, enabling real-time or pre-operation adjustment of blade positions to achieve precise alignment while maintaining a relatively simple overall structure through modular adjustment components.
Data Source
AI summary
Blades, base parts to which the blades are fixed, a guide mechanism configured to guide movement of the base parts in a direction in which the base parts are arranged side by side, and a linkage mechanism configured to parallelly change intervals of the base parts according to angle changes of link members coupled to the base parts, are included. An interval fine-adjustment mechanism is provided at each of coupling parts between the base pars and the link members, the interval fine-adjustment mechanism being configured to finely adjust positions of the base parts in the direction in which the base parts are arranged side by side, individually. According to this, a blade interval adjusting device capable of finely adjusting the intervals of the blades which transfer wafers etc., is provided.