Substrate Holding Robot with Inert Gas Purge Against Oxidation
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Solution Overview
Problem
Existing methods for maintaining high cleanliness in mini-environment spaces during the transport of thin plate-shaped substrates, such as semiconductor wafers, are costly and inefficient, leading to oxidation and contamination issues due to the circulation of inert gas and reactant gases, which can form natural oxide films and reduce processing yield.
Innovation Solution
A thin plate-shaped substrate transport robot equipped with a holding device that locally replaces the atmosphere around the substrate with inert gas, using a purge plate to discharge inert gas onto the substrate surface, while maintaining the rest of the environment in a clean state, thus preventing oxidation and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional substrate holding device with a cup-shaped holder is used, then the substrate can be held, but the substrate surface becomes contaminated with dust particles and the holder becomes clogged with foreign substances
Solution Approach 1:
The holding device is divided into multiple independent magnetic holders arranged in an array, each capable of holding substrates independently. This segmentation allows individual holders to be replaced or cleaned without affecting the entire system, and prevents contamination from spreading across all holders.
Solution Approach 2:
A magnetic field is introduced as an intermediary force to hold substrates without physical contact. The magnetic holders use magnetic attraction to suspend substrates in place, eliminating the need for direct mechanical contact that would cause dust generation and clogging.
2Reliability
If magnetic holders are used to avoid contact, then contamination is reduced, but the device complexity increases due to multiple components
Solution Approach 1:
Multiple magnetic holders are integrated into a single modular array structure that functions as one cohesive unit. The holders share common mounting mechanisms and control systems, reducing overall system complexity despite having multiple individual holding elements.
Solution Approach 2:
The magnetic holder array is designed to handle multiple substrates simultaneously and can be used for various substrate sizes and types by adjusting the magnetic field strength and holder configuration. This multi-functionality reduces the need for multiple specialized devices.
3Reliability
If substrates are transported through a tunnel structure, then contamination is minimized, but the transport distance and time increase
Solution Approach 1:
The magnetic holders are positioned at the same magnetic potential level, allowing substrates to be transferred horizontally between holders without vertical movement. This eliminates the need for complex tunnel structures and reduces transport time while maintaining contamination protection.
Solution Approach 2:
Instead of transporting substrates through a long tunnel, multiple magnetic holders are positioned close together in parallel, creating multiple short transport paths. This allows substrates to be quickly transferred between adjacent holders without requiring extensive tunnel infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs by minimizing the need for extensive inert gas circulation and chemical filters, while effectively preventing oxidation and contamination of the substrate surfaces during transport.
Implementation Method 1
a magnetic holder for holding the thin plate-shaped substrate by use of magnetic force
Data Source
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AI summary
Provided is a holding device 45 capable of holding securely and transporting a thin plate-shaped substrate for which surface processing has been completed without causing a natural oxide film to form on the surface to be processed thereof. This holding device 45 comprises a holding member 47 for holding the thin plate-shaped substrate, a purge plate 46 having formed therein a flow path 52 for the purpose of flowing therethrough an inert gas, and a piping member for connecting an inert gas supply source to the flow path 52. The purge plate 46 is equipped with discharged ports 51, which communicate with the flow path 52 and are provided on a surface facing the surface to be processed of the thin plate-shaped substrate held by the loading member 47, for the purpose of discharging the inert gas onto the processing surface of the thin plate-shaped substrate. In addition, the holding device 45 is equipped with a raising and lowering mechanism 48 that cause the holding member 47 and the purge plate 46 to be raised and lowered relative to each other.