Two-Layer Substrate Routing for High-Speed Signal Isolation
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Solution Overview
Problem
Current package substrates are inadequate for handling high-speed signals, leading to signal interference and noise due to inefficient routing designs.
Innovation Solution
A routing pattern for package substrates featuring electrically conductive bond fingers in concentric rings, with high-speed signals routed through the innermost ring to the most interior contacts and low-speed signals routed through outer rings to peripheral contacts, utilizing only two layers to minimize interference by keeping high-speed traces short and separate from low-speed traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional multi-layer routing is used to handle high-speed signals, then signal routing capacity is improved, but trace length and interference with low-speed signals increase
Solution Approach 1:
The patent segments the routing into two distinct layers: Layer 1 exclusively for high-speed signals and Layer 2 for low-speed signals. This physical separation eliminates interference between signal types while maintaining high routing capacity. The bond fingers are also segmented into inner rings for high-speed signals and outer rings for low-speed signals.
Solution Approach 2:
The patent utilizes the vertical dimension by assigning different signal types to different layers. High-speed signals occupy Layer 1 while low-speed signals occupy Layer 2, creating a three-dimensional routing solution that resolves interference issues without increasing horizontal trace length.
2Productivity
If high-speed signals are routed through outer bond finger rings, then routing capacity is improved, but trace length increases causing more noise and interference
Solution Approach 1:
The patent applies local quality by assigning different functions to different spatial locations: inner bond finger rings are dedicated to high-speed signals requiring short traces, while outer bond finger rings handle low-speed signals. This localized functional assignment optimizes each region for its specific signal type.
3Productivity
If more routing layers are added to increase signal density, then routing capacity is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges both high-speed and low-speed signal routing into a two-layer configuration, achieving high signal density without requiring three or more layers. The design consolidates routing efficiency with manufacturing simplicity by using only two copper layers.
Data Source
AI summary
A routing pattern for high speed signals for a package substrate. Electrically conductive bond fingers are disposed on a first surface of the package substrate. The first surface is adapted to receive an integrated circuit in an attachment zone, and the bond fingers are disposed in at least two substantially concentric rings around the attachment zone. The bond fingers of the innermost ring of bond fingers are all routed to electrically conductive first traces disposed on a first layer of the package substrate. The bond fingers other that those on the innermost ring of bond fingers are all routed to electrically conductive second traces disposed on a separate second layer of the package substrate. The package substrate has electrically conductive traces on only the first layer and the second layer. Electrically conductive contacts are disposed on a substantially opposing second surface. The first traces are all routed to a first set of the contacts that are all disposed within an innermost portion of the second surface, and the second traces are all routed to a second set of the contacts that are all disposed within an outermost portion of the second surface.