Substrate Package Seal Height Control via Support Parts

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In the display technology field, the packaging of substrates without spacers leads to difficulties in controlling the seal height and width, resulting in inconsistent tightness and potential package failures.

Innovation Solution

A package method involving a glass substrate with inorganic support parts of uniform height and shape, which are used to maintain consistent seal height and width by forming and cutting these parts during the bonding and sealing process, ensuring uniformity and stability of the seal without spacers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If seal without spacers is used for packaging, then pollution is reduced and manufacturing simplicity is improved, but seal height and width control becomes difficult

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidseal height and width control
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent introduces spacers as intermediary elements within the seal structure. These spacers serve as mediators that physically maintain the gap between the package cover plate and substrate, enabling precise control of seal height and width without requiring complex external fixtures or adjustment mechanisms.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent controls seal dimensions by adjusting spacer parameters (height, width, material properties) rather than changing the entire seal structure. By modifying spacer height, the seal height is directly controlled; by adjusting spacer width and spacing, the seal width is controlled. This allows precise dimensional control while maintaining manufacturing simplicity.

Inventive Principle:
Principle #35Parameter changes

2Device complexity

If seal without spacers is used for packaging, then the packaging process is simplified, but seal height and width uniformity deteriorates

Engineering Contradiction:
Improvepackaging process complexityVSAvoidseal height and width uniformity
Core Design Contradiction:
Device complexityVSStability of the object's composition

Solution Approach 1:

The patent divides the seal into multiple segments with spacers distributed at different positions (corners, edges, and intermediate locations). This segmentation allows each spacer to independently maintain local gap uniformity, ensuring overall seal height and width consistency across the entire package structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The spacers are pre-positioned within the seal structure before the bonding process. This preliminary positioning ensures that the correct gap distance is established from the beginning, preventing variations in seal dimensions and ensuring uniformity without requiring complex real-time adjustment mechanisms during packaging.

Inventive Principle:
Principle #10Preliminary action

3Quantity of substance

If seal without spacers is used for packaging, then material usage is reduced, but package tightness deteriorates

Engineering Contradiction:
Improvematerial usageVSAvoidpackage tightness
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent optimizes spacer parameters (height, width, spacing distribution) to achieve the minimum necessary material quantity while maintaining adequate package tightness. By precisely calculating and setting spacer dimensions, the seal maintains consistent contact pressure and gap control, ensuring reliable sealing without excess material.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method ensures consistent seal height and width, enhancing the package's tightness and simplifying the manufacturing process, resulting in a more reliable and efficient packaging outcome.

Implementation Method 1

the seal layer is formed by a polymerization reaction of a seal material

Methodology Applied
Scientific EffectPolymerization: Photopolymerisation

Implementation Method 2

The ultraviolet (UV) curing technology is the earliest and the most common LCD/OLED package skill

Methodology Applied
Scientific EffectUV curing: Photopolymerisation

Data Source

PatentUS10069115B2Package method of substrate
Publication Date: 2018.09.04 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • US10069115B2 patent drawing
  • US10069115B2 patent drawing
  • US10069115B2 patent drawing

AI summary

The present invention provides a package method of a substrate. By forming a plurality of support parts which are separately located at the border position of the package cover plate, the gap of the package cover plate and the substrate is limited after para bonding the package cover plate and the substrate. Thus, the seal height of the seal which does not contain the spacers can be ensured, and under circumstance of certain seal coating volume, the seal width of the seal also can be ensured. Furthermore, by cutting off the plurality of support parts, and border parts of the substrate and the package cover plate contacting with the support parts, the substrate packaged with the seal which does not contain the spacers can be obtained, and it is ensured that the seal has the consistent height and width.