Substrate Separation Control Using Displacement Detection
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Solution Overview
Problem
The challenge lies in efficiently separating thin, large-diameter semiconductor substrates during manufacturing, as they can bend or break during transfer or polishing, and existing methods lack precision in determining the completion of separation processing, leading to inefficiencies.
Innovation Solution
A substrate processing apparatus with a processing device applying thermal or light energy to an energy-absorbing layer between substrates, coupled with a measurement device to monitor displacement, allowing for precise control and determination of separation completion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If thermal energy or light energy is applied to separate the first substrate from the combined substrate, then the separation processing is performed, but it is difficult to determine precisely when the separation is complete, leading to extended processing time
Solution Approach 1:
The patent employs a feedback mechanism where the controller continuously monitors the displacement of the first substrate during thermal or light energy application and uses this real-time information to determine when separation is complete. This closed-loop control allows the system to stop energy application precisely when separation finishes, eliminating unnecessary heating time while ensuring complete separation.
Solution Approach 2:
The patent replaces traditional mechanical or time-based separation determination methods with an optical measurement system. By using a measurement device to detect substrate displacement and converting this physical measurement into separation completion determination, the system achieves precise timing without relying on extended heating periods or mechanical indicators.
2Ease of manufacture
If thin, large-diameter semiconductor substrates are transferred or polished without support, then the processing is simpler, but the substrates may bend or break
Solution Approach 1:
The patent uses a support substrate as an intermediary element between the thin semiconductor substrate and the processing environment. This support substrate provides mechanical strength and stability during transfer and polishing operations, preventing bending and breakage of the thin substrate while allowing the processing to proceed. The support substrate acts as a temporary mediator that is later removed.
Solution Approach 2:
The patent creates a composite structure by bonding the thin semiconductor substrate to a support substrate with appropriate mechanical properties. This composite structure combines the electrical and functional properties of the semiconductor substrate with the mechanical strength of the support substrate, enabling safe handling and processing. The composite approach allows simple processing procedures while maintaining substrate integrity.
3Strength
If the support substrate is bonded to the semiconductor substrate for reinforcement, then the substrate strength is improved, but an additional separation step is required
Solution Approach 1:
The patent applies parameter changes to the bonding interface between the support substrate and semiconductor substrate. By controlling the bonding strength parameters and using energy application (thermal or light) to selectively modify the bonding characteristics of the energy absorbing layer, the system enables easy separation after processing. The bonding parameters are optimized to provide strong attachment during processing but allow controlled separation when needed.
Solution Approach 2:
The patent utilizes phase transitions or state changes in the energy absorbing layer during separation. By applying thermal or light energy, the bonding characteristics of the energy absorbing layer change, transitioning from a bonded state during processing to a separable state during removal. This phase transition approach allows the support substrate to be easily removed after serving its reinforcing purpose.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and precise separation processing by accurately detecting the completion of substrate separation, reducing unnecessary heating time and enhancing processing efficiency.
Implementation Method 1
apply, in a combined substrate in which an energy absorbing layer is provided between a pair of substrates, at least one of thermal energy or light energy to the energy absorbing layer
Implementation Method 2
apply, in a combined substrate in which an energy absorbing layer is provided between a pair of substrates, at least one of thermal energy or light energy to the energy absorbing layer
Data Source
AI summary
A substrate processing apparatus includes a processing device 40; a measurement device 60; and a controller31. The processing device 40 is configured to apply, in a combined substrate T in which an energy absorbing layer E is provided between a pair of substrates, at least one of thermal energy or light energy to the energy absorbing layer E to separate a first substrate from the combined substrate while holding a second substrate. The measurement device 60 is configured to measure a displacement of the first substrate in the processing device 40. The controller 31 is configured to control the devices. Further, the controller 31 determines, based on the displacement of the first substrate, whether the first substrate is separated.