Semiconductor Substrate Separation With Optical Completion Detection
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Solution Overview
Problem
Existing semiconductor substrate separation methods face challenges in accurately determining the completion of separation due to complexities in light detection, leading to potential erroneous determinations.
Innovation Solution
A separating apparatus and system that includes a first holder to move the first substrate away from the second substrate, a light emitting device to emit light parallel to their bonding surface, and a light receiving device to detect this light, with a controller determining separation completion based on the position or movement direction of the first holder relative to the second holder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If light detection is used to determine separation completion, then separation accuracy can be improved, but erroneous determination may occur due to light detection complexities
Solution Approach 1:
The patent introduces a light-emitting device and light-receiving device as intermediary components to detect separation status. The light-emitting device emits light toward the bonding surface, and the light-receiving device detects the reflected or transmitted light to determine whether separation is complete, providing an indirect but reliable measurement method that avoids direct contact with the substrates.
Solution Approach 2:
The patent replaces mechanical or direct contact-based separation detection methods with an optical detection system. By using light emission and reception to monitor the separation process, the system eliminates the need for mechanical sensors that may interfere with the separation or provide inaccurate readings due to physical contact.
2Manufacturing precision
If the first holder moves the first substrate away from the second substrate, then separation is achieved, but determining completion becomes complex
Solution Approach 1:
The light-emitting device and light-receiving device are integrated into the existing holder system, allowing these components to serve multiple functions: they not only detect separation completion but also provide guidance for the separation process and can be used for positioning. This multi-functionality reduces the need for separate detection systems, thereby managing complexity while maintaining precision.
Solution Approach 2:
The patent implements a feedback mechanism where the light-receiving device continuously monitors the separation status and provides real-time information to the control system. This feedback allows the first holder to adjust its movement dynamically, ensuring precise separation completion without requiring overly complex pre-programmed sequences or multiple verification steps.
3Measurement precision
If light is emitted parallel to the bonding surface, then separation detection is improved, but light reception may be affected by substrate separation
Solution Approach 1:
The patent positions the light-emitting device and light-receiving device in a configuration where light is emitted parallel to the bonding surface rather than perpendicular to it. This dimensional change in light propagation allows the system to detect separation along the plane of the bonding interface, providing better precision for detecting when substrates are separated while minimizing signal loss that would occur with perpendicular emission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses erroneous determination of separation completion by using light detection and movement analysis, ensuring accurate separation of semiconductor substrates.
Implementation Method 1
a light emitting device disposed at a position away from a plate surface on a first substrate side of the combined substrate in a direction in which the first substrate is moved by the first holder and configured to emit light parallel to a bonding surface between the first substrate and the second substrate of the combined substrate
Implementation Method 2
a light receiving device configured to receive light emitted from the light emitting device
Implementation Method 3
a first holder configured to attract and hold a first substrate of a combined substrate
Implementation Method 4
a second holder configured to attract and hold the second substrate of the combined substrate
Data Source
AI summary
A separating apparatus includes a first holder configured to move a first substrate to be away from a second substrate; a second holder; a controller configured to move the first substrate to be away from the second substrate; a light emitting device configured to emit light parallel to a bonding surface between the first substrate and the second substrate; and a light receiving device configured to receive light emitted from the light emitting device. In a case where the light from the light emitting device is not received by the light receiving device due to separation of a part of the first substrate from the second substrate and then the light is received, the controller determines whether separation of the first substrate from the second substrate is completed based on a position or a movement direction of the first holder with respect to the second holder.