Semiconductor Substrate Separation via Release Layer Adhesion Control

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Solution Overview

Problem

Existing methods for separating substrates from supports in semiconductor manufacturing often damage the substrate due to the need for physical insertion or excessive force, which can lead to substrate damage during the separation process.

Innovation Solution

A supporting member separation method that involves a preliminary treatment step to reduce the adhesive force of a release layer on the substrate or support using light irradiation, allowing for the separation of the support from the substrate without direct contact or excessive force by concentrating the force on the altered release layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a blade is inserted into the adhesive layer to separate the substrate and support, then the separation can be achieved, but the substrate may be damaged due to direct contact with the blade

Engineering Contradiction:

Improveseparation processVSAvoidsubstrate damage

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a release layer as an intermediary between the substrate and support. This release layer has controlled adhesive properties that allow it to bond to both the substrate and support, enabling separation of the substrate from the support without direct contact between the substrate and the separation tool. The release layer acts as a mediator that facilitates the separation process while protecting the substrate from damage.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies preliminary treatment to the release layer before the separation process. This preliminary action modifies the adhesive force of the release layer, reducing it to an appropriate level that enables easy separation. By preparing the release layer in advance with the right adhesive properties, the subsequent separation can be performed without excessive force that would damage the substrate.

Inventive Principle:

Principle #10Preliminary action

2Productivity

If excessive force is applied to separate the substrate from the support, then the separation can be achieved, but the substrate may be damaged

Engineering Contradiction:

Improveseparation efficiencyVSAvoidsubstrate damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the adhesive parameter of the release layer through preliminary treatment. By controlling and reducing the adhesive force of the release layer to an optimal level, the separation process requires minimal force. This parameter change in the adhesive properties allows for efficient separation without applying excessive force that would damage the substrate.

Inventive Principle:

Principle #35Parameter changes

3Strength

If the adhesive force of the release layer is high, then the substrate is well-supported during manufacturing, but separation becomes difficult and may damage the substrate

Engineering Contradiction:

Improvebonding strengthVSAvoidseparation ease

Core Design Contradiction:

StrengthVSEase of operation

Solution Approach 1:

The patent employs preliminary treatment to change the adhesive parameter of the release layer from a high bonding strength state during manufacturing to a reduced adhesive force state for separation. This parameter change allows the release layer to provide strong support during the manufacturing process while enabling easy separation afterward without damaging the substrate.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively prevents substrate damage during separation by reducing the adhesive force and allowing for controlled separation, thereby improving the yield and integrity of semiconductor chips.

Implementation Method 1

a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support... a preliminary treatment step of reducing the adhesive force of at least a part of the release layer

Methodology Applied

Scientific EffectLight absorption: Absorption (EM radiation)

Data Source

PatentUS9627235B2Supporting member separation method

Publication Date: 2017.04.18 TOKYO OHKA KOGYO CO LTD

AI summary

A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.