Substrate Shielding Layer for EMI Reduction in Memory Devices
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Solution Overview
Problem
The miniaturization of electronic devices is hindered by the occurrence of electromagnetic interference (EMI), which existing technologies struggle to effectively address due to the height and width of conventional EMI shields.
Innovation Solution
A memory device and semiconductor device design featuring a substrate with a ground layer and a shielding layer that extends to lateral surfaces, contacting an exposed surface of the ground layer, along with a semiconductor chip and molding member, to effectively shield EMI while allowing for miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional EMI shields are used to shield electromagnetic interference, then EMI shielding effectiveness is improved, but device size increases due to the height and width requirements of conventional shields
Solution Approach 1:
The EMI shielding structure transitions from a conventional three-dimensional box-like shield to a planar two-dimensional structure integrated within the package substrate. The shielding layer is formed as a flat pattern on the substrate surface, eliminating the need for vertical height while maintaining EMI shielding effectiveness through strategic placement of conductive elements that block electromagnetic fields in the critical planar directions.
Solution Approach 2:
The EMI shielding function is merged with the package substrate structure itself. The shielding layer is formed as an integral part of the substrate, combining the mechanical support function of the substrate with the EMI shielding function in a single integrated component, thereby eliminating the need for separate shield structures and reducing overall device volume.
2Volume of moving object
If EMI shielding is integrated within the device structure, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The package substrate is designed to serve multiple functions simultaneously: mechanical support, electrical interconnection, and EMI shielding. By making the substrate universal and multi-functional, the number of separate components and assembly steps is reduced, thereby lowering manufacturing complexity despite the integrated EMI shielding feature.
Solution Approach 2:
The EMI shielding layer is segmented into multiple conductive patterns and regions distributed across the substrate, each serving specific shielding zones. This segmentation allows the shielding function to be achieved through distributed simple patterns rather than a single complex continuous structure, simplifying the manufacturing process through standard photolithography techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively shields electromagnetic interference, facilitating the miniaturization of electronic devices by integrating EMI shielding within the device structure without increasing its size.
Implementation Method 1
a shielding layer surrounding the molding member and extending to lateral surfaces of the substrate while contacting the exposed surface of the ground layer
Data Source
AI summary
The present disclosure provides a memory device and a fabricating method thereof. The memory device includes a substrate including a first metal layer formed therein, the first metal layer having at least a first surface with at least a first exposed portion of the first surface exposed at a lateral surface of the substrate, at least a first semiconductor chip formed on a top surface of the substrate, and a second metal layer surrounding the first semiconductor chip and extending to lateral surfaces of the substrate, at least a first portion of the second metal layer contacting the exposed surface of the first metal layer.