Electronic Component Substrate Spacer Unit Design
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Solution Overview
Problem
The existing semiconductor packaging technology faces challenges in miniaturizing the pitch between connection pads on substrates due to the increased size of copper core solder balls required for taller electronic components, which complicates the manufacturing of metal posts and widens the pitch between spacer units.
Innovation Solution
The implementation of a spacer unit with a stacked structure of a metal post and a cored solder ball, where the metal post is bonded to the solder layer on one substrate and the cored solder ball is bonded to the metal layer on the other substrate, with an insulation layer covering the side wall of the metal post, allowing for a reduced diameter of the connection terminals and narrowing the minimum pitch between spacer units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the height of electronic components is increased, then the distance between upper and lower substrates is increased, but the diameter of copper core solder balls must be enlarged which widens the pitch between connection pads
Solution Approach 1:
The spacer unit is divided into two functional segments: a metal post that provides the vertical distance maintenance function, and a cored solder ball that provides the electrical connection function. This segmentation allows the metal post diameter to be minimized for pitch reduction while the cored solder ball handles the bonding requirement, resolving the contradiction between maintaining substrate distance and minimizing connection pad pitch.
Solution Approach 2:
The invention transitions from using a single spherical spacer (zero-dimensional in terms of directional constraints) to a stacked structure with a metal post extending in the vertical dimension. This dimensional change allows the spacer unit to maintain the required distance between substrates through the post height while minimizing the lateral footprint through reduced post diameter, thereby narrowing the pitch between connection pads.
2Length of stationary object
If the diameter of copper core solder balls is enlarged to maintain distance between substrates, then the minimum pitch between solder balls is widened, but wiring patterns need to be miniaturized
Solution Approach 1:
By segmenting the spacer function into a metal post for distance maintenance and a cored solder ball for electrical connection, the invention allows the metal post diameter to be minimized. This enables narrower pitch between connection pads, which in turn facilitates the miniaturization of wiring patterns between substrates while maintaining the required vertical distance.
Solution Approach 2:
The invention changes the geometric parameters of the spacer unit by using a metal post with small diameter and controlled height, rather than a large-diameter spherical spacer. This parameter change allows the pitch between connection pads to be reduced, enabling wiring pattern miniaturization while preserving the substrate distance through the post height parameter.
3Length of stationary object
If copper core solder balls are used as spacers, then the distance between substrates is maintained, but the manufacturing complexity increases due to handling and positioning requirements
Solution Approach 1:
The spacer unit is segmented into a metal post attached to one substrate and a cored solder ball attached to the other substrate. This segmentation allows each component to be optimized for its specific function: the metal post for precise distance maintenance and easy positioning, and the cored solder ball for reliable electrical connection. This reduces manufacturing complexity compared to handling and positioning large spherical spacers.
Solution Approach 2:
The metal post acts as an intermediary element that simplifies the manufacturing process by providing a stable, easily positionable structure for maintaining substrate distance. The post can be precisely positioned and attached to one substrate before the other substrate is attached, reducing the complexity of simultaneous handling and positioning required for traditional spherical spacers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the miniaturization of the pitch between connection pads, facilitating the miniaturization of wiring patterns while maintaining the required distance between substrates, and reduces variations in metal post height, improving connectivity and manufacturing ease.
Implementation Method 1
When the solder melts, the copper core balls are held between the connection pads of the upper substrate and the connection pads of the lower substrate
Implementation Method 2
The solder functions as a bonding material, and the copper core ball functions as a spacer. Solder reflow is performed under a situation in which copper core solder balls are arranged between connection pads
Data Source
AI summary
An electronic component incorporated substrate includes a first substrate and a second substrate that are electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. An encapsulating resin fills a space between the first substrate and the second substrate to encapsulate the electronic component. The spacer unit includes a stacked structure of a metal post and a solder ball stacked in a stacking direction of the first substrate and the second substrate. The spacer unit further includes an insulation layer that is formed on the second substrate and covers a side wall of the metal post.