Package Substrate Stacked Interconnects Ground Signal Reduction

The patent transitions from planar interconnect arrangement to three-dimensional stacked interconnects. Multiple interconnect layers are vertically stacked within the substrate, allowing electrical paths to be formed in the vertical dimension. This enables higher interconnect density without increasing the package footprint, as interconnects are arranged in multiple levels rather than spreading out horizontally.

The patent segments the electrical path function across multiple independent interconnect layers. Each layer contains specific interconnects that provide electrical paths for different signal types (ground, power, I/O). This segmentation allows ground reference signals to be provided through dedicated ground interconnects in certain layers while other layers handle non-ground signals, eliminating the need for alternating ground and signal solder ball arrangements.

The patent uses vertical stacking to separate ground and non-ground signal paths into different layers. Ground reference signals are provided through ground interconnects in specific layers, while non-ground signals use interconnects in other layers. This layered separation allows the package to maintain proper signal referencing through dedicated ground paths while maximizing the number of solder balls available for non-ground signals, as they are not constrained by alternating arrangements.

The patent creates a universal interconnect architecture where certain interconnect layers can serve multiple functions. The stacked interconnect structure allows the same physical interconnect infrastructure to provide both ground referencing and non-ground signal transmission through different layers, rather than requiring separate dedicated solder balls for each function.