Substrate Support Bias Power Segmentation
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Solution Overview
Problem
Existing plasma processing apparatuses face challenges in efficiently providing bias power to objects on substrate supports, particularly in ensuring stable and independent bias power distribution to substrates and edge rings.
Innovation Solution
The substrate support incorporates a dielectric portion with integrated electrodes that receive bias power, allowing for efficient and independent power distribution to both the substrate and edge ring through separate electrostatic chuck portions, simplifying the design and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bias power is provided to the substrate through the base, then the substrate can receive bias power, but the edge ring cannot receive independent bias power
Solution Approach 1:
The substrate support is divided into functionally independent segments: the base for substrate bias power provision, and a separate edge ring bias power provision system through the electrostatic chuck. This segmentation allows independent bias power control for both substrate and edge ring, resolving the contradiction between stable base power delivery and versatile independent power distribution.
Solution Approach 2:
The electrostatic chuck acts as an intermediary component that enables bias power delivery to the edge ring without interfering with the base's primary function. By introducing this intermediate structure with integrated electrodes, the system achieves independent bias power provision to both substrate and edge ring simultaneously.
2Adaptability or versatility
If separate electrodes are used for substrate and edge ring bias power, then independent power provision is achieved, but device complexity increases
Solution Approach 1:
The electrostatic chuck is designed with multi-functionality, serving both as the holding mechanism for the substrate and as the power delivery path for the edge ring. By integrating bias power electrodes into the electrostatic chuck structure, the system achieves independent bias power provision without adding separate complex electrode systems, thus reducing overall device complexity.
Solution Approach 2:
The bias power delivery function is merged with the existing electrostatic chuck structure rather than adding separate independent electrodes. This consolidation allows the electrostatic chuck to simultaneously perform substrate holding and edge ring bias power delivery, simplifying the overall electrode configuration while maintaining independent power control capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables stable and efficient bias power provision to both the substrate and edge ring, enhancing the plasma processing apparatus's performance and manufacturability.
Implementation Method 1
The ESC receives and holds the substrate
Implementation Method 2
The substrate support may hold the edge ring under an electrostatic attraction
Implementation Method 3
The at least one electrode is located in the dielectric portion to provide bias power to an object placed on the dielectric portion
Data Source
AI summary
A structure efficiently provides bias power to an object placed on a substrate support. A substrate support includes a dielectric portion and at least one electrode. The at least one electrode is located in the dielectric portion to provide bias power to an object placed on the dielectric portion.