Electric Discharge Tubes TRIZ Cases

Controller manages cooling module to prevent navigation errors caused by thermal expansion in wafer inspection systems.

An IR interferometer measures layer thickness in focused ion beam tools using narrowband light interference patterns.

Vent apertures in a TEM liquid sample device remove internal gases to prevent sample bulging and maintain high image resolution.

L-shaped tabs and barbed posts secure the face member to the base, preventing twisting or pulling apart during operation.

Standard sample with varying width correction marks determines precise measurement functions for charged particle beam equipment.

A substrate processing apparatus uses an impedance meter to measure plasma generator impedance and a controller to adjust high frequency power.

A sputtering device uses a control unit to manage substrate movement and gas flow rates during deposition.

A bending electromagnet selectively deflects ion beams from multiple sources to downstream devices by adjusting magnetic field intensity.

A hybrid plasma reactor combines inductive and transformer coupled sources to generate stable plasma discharge across varying pressure levels.

SF6 plasma etching selectively removes silicon layers without damaging underlayer films or leaving residues.

Embedded coil in edge ring generates magnetic field to orient plasma ions, correcting tilted trench profiles at wafer edges.

Segmented chamber liner with evenly spaced holes distributes cleaning gas through multiple outlet points into the reaction chamber.

A compact lithography stage uses eccentric cams to drive carriages along a common base plate.

Segmented protrusions in a two-phase plasma generator achieve uniform plasma density, resolving non-uniformity caused by corona discharges at curved regions.

Segmented power supply electrodes paired with zigzag temperature adjustment passages deliver uniform gas mixing for stable atmospheric plasma generation.

A multi-lens array shifts individual beamlet focal points to maintain precise focus across the entire scanning area.

Segmented emitters on a flexible substrate disperse ions throughout HVAC ducts, resolving dispersion inefficiency in rigid systems.

An inner rotating plate and outer lifting ring in a PVD magnetron adjust magnetic fields to resolve non-uniform plasma density across the target surface.

Multi-charged particle beam writing apparatus reconfigures aperture openings to utilize remaining functional beams for continued pattern generation.

Transparent thin foil in environmental cell allows secondary radiation to reach external detector.

Dual electron beams charge and detect emitted electrons from specific conductor areas, locating discontinuities without lengthy sequential scanning.

Capacitance-based measurement of focus ring consumption maintains plasma processing uniformity by enabling timely replacement before wear degrades productivity.

An intermediate lens images secondary electron beams at a deflection point, reducing aberration and crosstalk caused by tight beam pitch.

Dome-shaped cathode housing caps eliminate sharp edges to prevent arcing and ensure predictable electron beam profiles.

A segmented permanent magnet arrangement creates a racetrack magnetic field with zero vertical flux points to expand the target erosion region.

A variable open ratio valve regulates exhaust flow to determine the etching endpoint in semiconductor fabrication.

A filtered radical mixture enhances silicon etch rates over silicon germanium by forming a protective polymer layer that prevents surface oxidation.

Annular magnet rows arranged concentrically cancel vertical magnetic field components, resolving complexity in plasma density distribution control.

Microstrip line replaces bulky waveguide to reduce device size while gas flow widening portion ensures uniform velocity distribution.

A charged particle beam device uses a movable shutter member to block gas flow between vacuum spaces without physical contact.

Hydrogen plasma smoothing prevents photoresist roughness from causing SiON sidewall striation during CHF-based etching.

Grooves in the base allow pressure sensors to detect adhesive erosion early, preventing gas leaks and substrate misalignment.

A tapered electrical terminal mounting end with a compliant slit reduces insertion force into micro via apertures.

Segmented vacuum coating zones with variable air reservoirs reduce energy consumption while maintaining high conveying speeds.

Continuous backside optical monitoring maintains uniform etch rates across the mask surface without interrupting production cycles.

Silicon coating on chamber walls stabilizes plasma and reduces particle generation, preventing critical dimension drift during high-throughput production.

Segmenting electrodes into parallel pairs distributes deflection across multiple units, reducing high-voltage aberrations in charged particle inspection tools.

A composite electrode switch device uses low electron affinity coatings to facilitate efficient electron emission.

Periodic correction coefficients adjust microwave levels to maintain consistent inner temperature despite machine differences.

Scanning electron microscopes weaken magnetic fields when samples are absent, preventing contamination and maintaining stable observation.

An injector unit with separated gas slots resolves the contradiction between productivity and device complexity in atomic layer deposition systems.