Substrate Support Insulator With Gas Conduits to Block Arcing
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Solution Overview
Problem
Current semiconductor fabrication techniques face challenges in precision and complexity due to limitations in traditional manufacturing methods for substrate supports, particularly in achieving desired material properties and geometries, which affect the accuracy and longevity of components in plasma processing environments.
Innovation Solution
The use of additive manufacturing (AM) techniques to design and fabricate substrate supports and components, enabling the creation of complex shapes, internal geometries, and new material compositions such as ceramic/metallic blends, which improve the fidelity and performance of substrate supports by reducing defects and extending their lifespan through refurbishment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional manufacturing methods are used to fabricate substrate supports, then manufacturing simplicity is maintained, but manufacturing precision and component fidelity deteriorate
Solution Approach 1:
The patent changes the manufacturing method from traditional subtractive or formative processes to additive manufacturing, fundamentally altering how substrate supports are created. This enables precise control over geometric parameters, material composition, and internal structures, achieving high manufacturing precision while accepting increased process complexity as a trade-off
Solution Approach 2:
The patent employs composite materials in the additive manufacturing process, allowing substrate supports to be fabricated with heterogeneous material properties within a single component. This enables optimization of different regions for specific functions (e.g., conductive regions, insulating regions, cooling channels) while maintaining overall structural integrity and precision
2Reliability
If traditional manufacturing methods are used, then process simplicity is maintained, but component complexity and performance fidelity deteriorate
Solution Approach 1:
The patent applies segmentation by dividing the substrate support into functionally distinct regions that are additive-manufactured with different material properties or structural characteristics. This allows each segment to be optimized for its specific function (e.g., electrostatic chucking, gas distribution, thermal management) while maintaining overall component reliability
Solution Approach 2:
The patent implements nesting by embedding functional elements (such as gas conduits, cooling channels, or sensor pathways) within the internal structure of the substrate support during additive manufacturing. This creates a multi-functional component where simpler elements are nested within the more complex external structure, enhancing fidelity without requiring separate assembled parts
3Manufacturing precision
If additive manufacturing is used to create complex geometries, then manufacturing precision improves, but manufacturing time increases
Solution Approach 1:
The patent applies preliminary action by performing digital modeling, simulation, and process optimization before the actual additive manufacturing process. This includes creating detailed 3D models, simulating manufacturing parameters, and pre-processing support structures to minimize post-processing time, thereby reducing overall manufacturing time while maintaining geometric precision
Solution Approach 2:
The patent implements local quality by applying different manufacturing parameters or material compositions to specific regions of the substrate support based on local functional requirements. This allows critical geometric features to be manufactured with higher precision settings while less critical areas use faster manufacturing parameters, optimizing the overall manufacturing time while maintaining necessary precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
AM techniques enhance the precision and complexity of substrate supports, reducing defects, improving performance, and extending the lifespan of components by allowing for localized regrowth and modification, thereby improving yield and reducing costs.
Implementation Method 1
a thickness of the insulator body exceeds an arcing threshold between the first body and the second body when the insulator body is arranged between the first body and the second body
Implementation Method 2
Each of the one or more gas conduits includes a gas conductance plug embedded within a first portion of the gas conduit and having at least a threshold gas conductance through the gas conductance plug, and where the gas conductance plug obstructs an electrical discharge path between the first body and the second body
Data Source
AI summary
Substrate support components including an integrally formed insulator body including a first surface and a second surface opposite the first surface, and a thickness of the insulator body exceeds an arcing threshold between the first body and the second body when the insulator body is arranged between a first electrically conductive body and a second electrically conductive body. The insulator body includes gas conduits within the insulator body and forming a gas flow path from the first surface to the second surface, including a gas conductance plug embedded within a first portion of the gas conduit and having at least a threshold gas conductance through the gas conductance plug, wherein the gas conductance plug obstructs an electrical discharge path between the first body and the second body when the insulator body is arranged with respect to the first body and the second body.