Substrate Support Bush Structure for Plasma Particle Reduction
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges due to assembly tolerances between the bush and the ceramic puck in the substrate support unit, which can lead to plasma entering these tolerance areas, generating particles and reducing product yield.
Innovation Solution
The substrate processing apparatus incorporates a substrate support unit with a bush design that includes a first bush with a tube shape and a second bush coupled to its outer peripheral surface. A protruding portion on the first bush is coupled to a concave portion on the ceramic puck, reducing assembly tolerance and enhancing bonding between the bush and the ceramic puck.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single bush structure is used in the substrate support unit, then the device complexity is reduced, but assembly tolerance between the bush and ceramic puck increases, leading to plasma entry and particle generation
Solution Approach 1:
The bush is divided into a first bush and a second bush that are coupled together. The first bush is bonded to the ceramic puck, while the second bush is coupled to the first bush. This segmentation allows each bush component to be manufactured and positioned independently, reducing cumulative assembly tolerance and preventing plasma from entering the interface region between the bush and ceramic puck.
2Ease of manufacture
If a single bush structure is used, then the manufacturing process is simpler, but the lift pin may be damaged due to assembly tolerance
Solution Approach 1:
By dividing the bush into two coupled components (first bush and second bush), the structure creates a more robust interface with the ceramic puck. The first bush is securely bonded to the ceramic puck, providing a stable guide for the lift pin, while the second bush is coupled to the first bush, ensuring proper positioning and reducing the risk of lift pin damage during substrate loading and unloading operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces assembly tolerance between the bush and the ceramic puck, preventing plasma from entering these areas and thereby reducing particle generation, improving product yield, and extending the lifespan of the substrate support unit.
Implementation Method 1
an adhesive layer for coupling between the ceramic puck and the base plate
Implementation Method 2
the first bush includes a protruding portion formed on an upper surface thereof... coupled to a concave portion on the ceramic puck
Data Source
AI summary
Disclosed is a substrate processing apparatus including a substrate support unit. The substrate support unit supports a substrate, has at least one pin hole formed vertically therethrough, and accommodates a lift pin therein so as to allow the lift pin to ascend and descend through the pin hole. The substrate support unit includes a ceramic puck on which the substrate is seated, a base plate configured to support the ceramic puck, an adhesive layer for coupling between the ceramic puck and the base plate, and a bush provided around the pin hole. The bush includes a first bush having a tube shape and a second bush coupled to an outer peripheral surface of the first bush, and the first bush includes a protruding portion formed on an upper surface thereof.