Substrate Support Coating for Uniform Deposition
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Solution Overview
Problem
Existing substrate processing technologies face challenges in controlling deposition thickness and achieving uniformity in thin film formation due to temperature variations and non-uniform heat transfer during plasma treatment.
Innovation Solution
A substrate processing apparatus with a support unit featuring a base with a heater and a coating layer of reduced thermal conductivity, allowing for controlled heat transfer and selective formation of a coating layer on the support unit to manage temperature differences and deposition variations, thereby enhancing deposition rate uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a uniform coating layer is formed on the entire support unit, then heat transfer is improved, but deposition thickness uniformity deteriorates due to temperature variations
Solution Approach 1:
The coating layer is selectively formed only in specific regions (coating regions) of the support unit rather than uniformly across the entire surface. This local quality approach allows different regions of the support unit to have different thermal properties, enabling precise control of temperature distribution to achieve uniform deposition thickness while maintaining effective heat transfer where needed.
2Productivity
If heating is applied to the support unit, then deposition rate is improved, but temperature variation across the substrate increases causing non-uniform deposition
Solution Approach 1:
The heater is positioned in specific regions of the support unit rather than providing uniform heating across the entire surface. This localized heating approach, combined with selective coating regions, creates controlled temperature gradients that maintain high deposition rates while ensuring uniform temperature distribution across the substrate surface, thereby achieving both high productivity and uniform deposition.
Solution Approach 2:
The coating layer acts as an intermediary between the heater and the substrate, mediating heat transfer. By selectively placing coating layers in specific regions, the patent controls how heat is transferred from the heater to the substrate, preventing excessive temperature variations and ensuring uniform deposition while maintaining efficient heat transfer for high deposition rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved deposition rate control and uniformity by managing temperature variations across the substrate, leading to consistent thin film formation and reduced thickness variations.
Implementation Method 1
a base having a top surface on which the substrate is placed; a heater disposed in the base; and a coating layer formed on the top surface of the base
Implementation Method 2
a coating layer formed on the top surface of the base
Implementation Method 3
a gas supply unit providing the inner space with a process gas required for generating plasma
Data Source
AI summary
Disclosed is a substrate processing apparatus. The substrate processing apparatus comprises a process chamber providing an inner space where a substrate is treated, a support unit disposed in the inner space and supporting the substrate, and a gas supply unit providing the inner space with a process gas required for generating plasma. The support unit comprises a base having a top surface on which the substrate is placed, a heater disposed in the base, and a coating layer formed on the top surface of the base.