Movable Substrate Support Between Conveyor Sections in Reflow Ovens
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Solution Overview
Problem
Conveying instability of electronic substrates occurs when moving between conveyor sections within and outside a vacuum treatment zone in reflow soldering ovens, leading to potential tilting and instability during the soldering process.
Innovation Solution
A support device is provided that can move between a supporting and rest position, ensuring stability by aligning with conveyor surfaces and providing support when electronic substrates are conveyed between adjacent sections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conveyor section within the vacuum treatment zone is spaced apart from the conveyor section outside the vacuum treatment zone, then the vacuum treatment zone can be sealed and maintained, but the conveying stability of the electronic substrates deteriorates due to the gap between conveyor sections
Solution Approach 1:
A support plate is introduced as an intermediary component between the first conveyor section and the second conveyor section. The support plate spans across the gap between these conveyor sections, providing continuous support for the electronic substrate during conveyance. This mediator element ensures that the substrate does not tilt or become unstable in the gap region, while the vacuum treatment zone maintains its sealed environment for vacuum processing.
2Adaptability or versatility
If the conveyor sections are arranged with a gap for vacuum zone access, then vacuum treatment can be applied, but the electronic substrate experiences tilting and instability during conveyance
Solution Approach 1:
The support plate serves as a mediator structure that allows the vacuum treatment zone to function while preventing substrate instability. It bridges the gap between conveyor sections, enabling vacuum access to the substrate without causing tilting or conveyance issues.
Solution Approach 2:
The support plate extends in the transverse direction (width direction) across the gap between conveyor sections, creating a dimensional solution that addresses the stability problem in the conveying direction (length direction) without interfering with the vacuum sealing in the vertical direction.
Data Source
Figure 1A
Figure 1B
Figure 2~3A
AI summary
The present disclosure provides an apparatus for joining electronic components to an electronic substrate including a frame, a first conveyor section and a second conveyor section, and a support device. The first and second conveyor sections are supported by the frame and arranged spaced apart from each other along a conveying direction of the electronic substrate, and the first and second conveyor sections have first and second conveying surfaces, respectively. A receiving area is provided between the first and second conveyor sections. The support device is coupled to the frame and movable between a supporting position and a rest position relative to the first conveyor section and the second conveyor section. The support device has a supporting surface. In the supporting position, the support device is at least partially located and held in the receiving area and the supporting surface is substantially flush with the first conveying surface and the second conveying surface. In the rest position, the support device exits the receiving area. Since the support device of the present disclosure can provide support when the electronic substrate is conveyed between the adjacent conveyor sections, the stability of conveying of the electronic substrate can be improved.