Sensor-Integrated Substrate Support for Load Lock Diagnostics
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Solution Overview
Problem
The degradation of components within the load lock chamber of electronic device manufacturing systems leads to unsatisfactory processing conditions, affecting substrate quality and increasing costs due to downtime and maintenance.
Innovation Solution
A substrate support device with integrated sensors is introduced, featuring a base, tower portions, arms for substrate support, and an indexer for adjusting the substrate's position. This device is manufactured using additive manufacturing, allowing for embedded electrical components and improved structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional substrate support devices are used in load lock chambers, then assembly and manufacturing are straightforward, but the devices lack real-time diagnostic capabilities and cannot detect component degradation
Solution Approach 1:
The patent combines the substrate support device with integrated sensors and diagnostic capabilities into a single unified structure. The sensors are embedded within the support device itself, allowing real-time monitoring of substrate conditions, load lock environment, and component health without requiring separate diagnostic equipment.
Solution Approach 2:
The substrate support device is designed to perform multiple functions simultaneously: supporting substrates during processing, providing real-time diagnostic data through integrated sensors, and monitoring component degradation. This multi-functionality eliminates the need for separate diagnostic systems while improving reliability.
2Strength
If additive manufacturing is used to create the substrate support device, then rigidity and weight are improved, but manufacturing complexity increases
Solution Approach 1:
The patent utilizes additive manufacturing to fundamentally change the structural parameters of the substrate support device, creating optimized geometries that maximize rigidity while minimizing weight. The additive process allows for complex internal structures and lattice designs that cannot be achieved with traditional manufacturing methods.
Solution Approach 2:
The additive manufacturing process enables the use of composite materials and optimized material distributions within the support device structure. This allows regions of high rigidity where needed while maintaining overall weight reduction, achieving superior mechanical properties compared to traditional homogeneous structures.
3Stability of the object's composition
If multiple separate components are used in the substrate support device, then assembly and repair are easier, but the device lacks structural integrity and requires more assembly steps
Solution Approach 1:
The patent merges multiple separate components into a single integrated substrate support device manufactured through additive processes. This monolithic structure eliminates assembly requirements, maximizes structural integrity, and reduces the number of potential failure points while maintaining ease of repair through modular sensor replacement.
Data Source
AI summary
A load lock including a substrate support device for supporting a substrate, and an indexer coupled to the substrate support device. The substrate support device may take measurements and acquire data to verify features of the supported substrate and an associated manufacturing system. Substrate features that are measured include, substrate temperature, substrate warping, and a substrate presence, absence, or misplacement on the support device. System features that are measured include system vibrations and substrate transfer mechanism calibration data. The substrate support device sensors and communications circuits can be integrated into the substrate support device, through use of an additive manufacturing process in making the substrate support device.