Package Substrate Support Structure for Void-Free Solder Reflow
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Solution Overview
Problem
The generation of trapped flux gas during the reflowing process of solder bumps leads to defects such as voids and beadings, adversely affecting bonding performance between a substrate and an electronic component, particularly for large components with heavy weight.
Innovation Solution
The introduction of supporting components on the substrate to support the electronic component during reflowing, maintaining a proper gap and providing a pathway for gas escape, thereby improving bonding quality through solder bumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a heavy electronic component is mounted directly on the substrate, then mechanical support is provided, but the gap between substrate and component decreases preventing flux gas escape
Solution Approach 1:
The patent introduces supporting components as intermediary elements between the substrate and the heavy electronic component. These supporting components provide mechanical support to hold the component at a proper height, maintaining a gap that allows flux gas to escape during reflowing, while not interfering with the soldering process.
Solution Approach 2:
The patent divides the support function into separate supporting components rather than relying on direct contact between the heavy component and substrate. This segmentation allows the support function to be decoupled from the soldering area, enabling gas escape pathways to be maintained while still providing necessary mechanical support.
2Reliability
If solder paste is applied directly under a heavy electronic component, then electrical connection is achieved, but voids and beadings occur due to trapped gas
Solution Approach 1:
The supporting components act as intermediaries that prevent direct compression of the solder paste by the heavy electronic component. This allows the solder paste to maintain proper morphology and form reliable electrical connections without being deformed by the component's weight during reflowing.
Solution Approach 2:
The supporting components are placed in advance to prevent the harmful compression effect before it occurs. By providing preliminary support, the system prevents the solder paste from being pressed too closely against the substrate, thereby preventing void formation and beading issues before the reflowing process completes.
3Productivity
If the electronic component is placed close to the substrate, then assembly density is improved, but gas escape pathways are blocked
Solution Approach 1:
The patent uses supporting components to manage the vertical dimension (height) of the assembly. By controlling the vertical spacing between the substrate and electronic component, the system maintains gas escape pathways while achieving high assembly density through optimized component placement and support structure design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances bonding performance by reducing voids and short-circuit risks, ensuring stable electrical connections and mechanical support for heavy electronic components.
Implementation Method 1
During the reflowing process, the solder powders may melt and be reshaped
Implementation Method 2
the flux may be activated and vaporized, and bubbles of the vaporized flux may be generated
Data Source
AI summary
A method for forming an electronic device is provided. The method comprises: providing a package substrate with a first set of conductive pads formed thereon; forming supporting components on the package substrate without covering the first set of conductive pads; depositing a solder material onto the first set of conductive pads; mounting an electronic component having a second set of conductive pads onto the package substrate to align each of the first set of conductive pads with one of the second set of conductive pads; and reflowing the solder material to electrically connect the electronic component with the package substrate through the first and second sets of conductive pads, wherein the electronic component is supported by the supporting components during the reflowing.