Substrate Support Stage Temperature Uniformity via Piezoelectric Flow Control
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in achieving uniform temperature distribution across the substrate support stage, leading to inconsistent processing conditions.
Innovation Solution
The apparatus incorporates a substrate support stage with recesses and supply/collection pipes, featuring a piezoelectric element to adjust the nozzle opening size based on applied voltage and thermoelectric elements to generate electromotive forces, optimizing heat transfer medium flow and temperature uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat transfer medium is supplied to substrate support stage to control temperature, then temperature control is achieved, but temperature distribution uniformity deteriorates
Solution Approach 1:
The substrate support stage is divided into multiple regions with separate recesses (first recess, second recess, etc.), each equipped with independent supply pipes and collection pipes. This segmentation allows different heat transfer medium flows to be applied to different regions, enabling localized temperature control to achieve uniform overall temperature distribution.
Solution Approach 2:
Different regions of the substrate support stage are provided with different flow velocities of heat transfer medium based on local temperature requirements. The piezoelectric elements adjust nozzle openings locally to control flow velocity, creating localized quality variations that result in uniform temperature distribution across the entire substrate.
2Manufacturing precision
If piezoelectric element adjusts nozzle opening to control flow velocity, then temperature uniformity improves, but device complexity increases
Solution Approach 1:
Thermoelectric elements are placed between collection pipes to generate electromotive forces based on temperature differences. These electromotive forces provide feedback signals to the drive circuit, which automatically adjusts the piezoelectric element actuation to equalize flow velocities and temperatures, reducing the need for complex external control systems.
Solution Approach 2:
The thermoelectric elements automatically generate control signals based on local temperature differences without requiring external sensors or complex control algorithms. The system self-regulates by using the temperature differences themselves to drive the correction mechanism through the piezoelectric elements.
3Manufacturing precision
If multiple supply pipes and partitions are added to improve temperature control, then temperature distribution improves, but device complexity increases
Solution Approach 1:
The partition structures are integrated into the substrate support stage itself, with recesses formed directly in the support stage. The supply pipes and collection pipes are nested within these recesses, creating a compact integrated structure that reduces the number of separate components while maintaining the functionality of multiple regional control zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances temperature uniformity across the substrate support stage by adjusting the flow velocity of the heat transfer medium, reducing temperature differences and improving processing consistency.
Implementation Method 1
a piezoelectric element that is disposed around an opening of the second nozzle to reduce a cross-sectional area of the opening of the second nozzle in accordance with a voltage applied thereto
Implementation Method 2
a thermoelectric element that is disposed between the first collection pipe and the second collection pipe to generate an electromotive force corresponding to a temperature difference between the heat transfer medium in the first collection pipe and the heat transfer medium in the second collection pipe
Data Source
AI summary
In an exemplary embodiment, a substrate processing apparatus is provided. The substrate processing apparatus includes a processing chamber, a substrate support stage. The piezoelectric element is disposed around an opening of the second nozzle to reduce a cross-sectional area of the opening of the second nozzle in accordance with a voltage applied thereto. The thermoelectric element is disposed between the first collection pipe and the second collection pipe to generate an electromotive force corresponding to a temperature difference between the heat transfer medium in the first collection pipe and the heat transfer medium in the second collection pipe. The drive circuit is configured to apply a voltage corresponding to a magnitude of the electromotive force, to the piezoelectric element.