Substrate Support Structure for Uniform Plasma Etching Temperature
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Solution Overview
Problem
The existing substrate processing apparatuses face challenges in achieving uniform temperature distribution during the plasma etching process, leading to potential issues with substrate yield and quality.
Innovation Solution
The apparatus incorporates a support unit with a puck having a first thermal conductivity and a concave groove, along with a block of higher thermal conductivity, and utilizes separate heat transfer medium supply units to provide heat transfer medium at different fluid pressures to the substrate, ensuring temperature uniformity through a combination of heat transfer and thermal conductivity management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a uniform support unit structure is used, then the device complexity is reduced, but the temperature uniformity across the substrate deteriorates
Solution Approach 1:
The support unit incorporates regions with different thermal conductivities: a first region with lower thermal conductivity and a second region with higher thermal conductivity. This local differentiation allows the support unit to compensate for non-uniform heat distribution across the substrate, achieving temperature uniformity without requiring complex external control systems.
Solution Approach 2:
The support unit is constructed as a composite structure combining materials or regions with different thermal conductivities. This composite design enables the support unit to simultaneously provide structural support and active thermal management, resolving the contradiction between structural simplicity and temperature uniformity.
2Device complexity
If heat transfer medium is supplied at uniform pressure, then the device complexity is reduced, but the temperature distribution across the substrate becomes non-uniform
Solution Approach 1:
The heat transfer medium supply system provides different fluid pressures to different regions of the support unit. Specifically, a first fluid pressure is supplied to the first region and a second fluid pressure is supplied to the second region. This local differentiation in pressure enables optimized heat transfer to different substrate areas, achieving uniform temperature distribution.
3Temperature
If the thermal conductivity of the support unit is increased, then the temperature uniformity is improved, but the energy loss increases due to excessive heat transfer
Solution Approach 1:
Rather than uniformly increasing thermal conductivity across the entire support unit, the invention uses localized regions of different thermal conductivities. The first region has lower thermal conductivity and the second region has higher thermal conductivity, allowing heat to be directed where needed while minimizing unnecessary energy loss in other areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances temperature uniformity across the substrate, improving the yield and quality of the substrate processing by effectively managing thermal conductivity and fluid pressure distribution.
Implementation Method 1
the support unit comprises a puck having a first thermal conductivity and having a concave groove formed thereon, and a block provided in the concave groove and having a second thermal conductivity different from the first thermal conductivity
Implementation Method 2
a first heat transfer medium supply unit for supplying heat transfer medium to the support unit at a first fluid pressure, and a second heat transfer medium supply unit for supplying the heat transfer medium to the support unit at a second fluid pressure different from the first fluid pressure
Data Source
AI summary
Provided is a substrate processing apparatus. The substrate processing apparatus of the present invention comprises a support unit provided in a processing space for processing a substrate and for supporting the substrate, wherein the support unit comprises a puck having a first thermal conductivity and having a concave groove formed thereon; and a block provided in the concave groove and having a second thermal conductivity different from the first thermal conductivity.