Substrate Supporting Member Thermal Conductivity Gradient
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Solution Overview
Problem
In semiconductor manufacturing processes, especially during plasma etching, the peripheral portions of substrates are not adequately cooled, leading to non-uniform substrate temperatures and compromised etching uniformity due to the susceptor's smaller top surface area, resulting in varying line widths across the substrate.
Innovation Solution
A substrate supporting member with a surface divided into central, intermediate, and peripheral regions, where thermal conductivity is controlled by varying the number and contact area of protruded portions, and potentially altering materials or surface roughness, to ensure uniform temperature maintenance across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the susceptor top surface is made smaller than the substrate to prevent etching exposure, then the susceptor is protected from plasma etching, but the peripheral portion of the substrate is not adequately cooled resulting in non-uniform temperature distribution
Solution Approach 1:
The substrate supporting surface is divided into three regions (central, intermediate, peripheral) with different thermal conductivity characteristics. The peripheral region has higher thermal conductivity to provide enhanced cooling, the central region has lower thermal conductivity to maintain temperature, and the intermediate region provides a gradient transition. This local differentiation of thermal properties resolves the contradiction by providing region-specific thermal management.
2Device complexity
If the peripheral portion of the substrate is extended beyond the susceptor, then the susceptor structure is simplified, but the peripheral portion receives excessive heat resulting in non-uniform in-surface temperature and compromised etching uniformity
Solution Approach 1:
The substrate supporting surface incorporates regions with spatially varying thermal conductivity properties. The peripheral region uses protruded portions with larger contact areas or different materials to increase thermal conductivity for enhanced cooling, while the central region maintains lower thermal conductivity. This local quality differentiation enables simplified susceptor structure while achieving uniform temperature distribution and consistent line width across the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach maintains uniform in-surface temperatures of the substrate during plasma processing, enhancing etching uniformity and improving production yield by managing thermal conductivity between the substrate and the supporting surface.
Implementation Method 1
controlling a temperature of the substrate by thermal transfer between the substrate and the substrate supporting surface
Data Source
AI summary
A substrate supporting member, and a substrate processing apparatus including the substrate supporting member are provided. The substrate supporting member for mounting and supporting a substrate on a substrate supporting surface thereof, and controlling a temperature of the substrate by thermal transfer between the substrate and the substrate supporting surface, wherein the substrate supporting surface is smaller than the substrate, and includes a central region, an intermediate region, and a peripheral region. A thermal conductivity between the substrate and the peripheral region is greater than that between the substrate and the central region which is greater than that between the substrate and the intermediate region located between the central region and the peripheral region.