Substrate Surface Treatment for Thin-Film Printing Precision
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Solution Overview
Problem
Ink-jet printing technologies face challenges in achieving uniform morphology and precise surface energy control for thin film devices due to varying surface energies of substrate patterns, requiring modifications to dispersive and polar components of substrates to meet specific printing requirements.
Innovation Solution
A method involving surface treatment using self-assembled monomolecular layers and ultraviolet-ozone cleaning to modify the dispersive and polar components of substrate patterns, allowing for adjustment of surface energies to achieve desired differences for improved printing precision and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the surface energies of various substrate patterns are reduced to make them similar, then the uniformity of thin film morphology is improved, but the precision of thin film printing is reduced
Solution Approach 1:
The patent applies different surface treatments to different substrate patterns to create locally optimized surface energies. By treating each substrate pattern according to its specific material properties and printing requirements, the method achieves both uniform thin film morphology across all patterns and high printing precision for each individual pattern.
Solution Approach 2:
The patent modifies surface energy parameters (dispersive and polar components) of substrate patterns through chemical treatments. By adjusting these parameters to meet specific printing requirements, the method resolves the contradiction between achieving uniform morphology and maintaining high printing precision.
2Manufacturing precision
If the surface energy of substrate patterns is increased to increase printing precision, then the precision of thin film printing is improved, but the uniformity of thin film morphology deteriorates
Solution Approach 1:
The patent implements localized surface energy optimization by applying specific treatments to individual substrate patterns. This allows each pattern to have the appropriate surface energy for high-precision printing while the overall distribution remains uniform, resolving the contradiction between local precision and global uniformity.
Solution Approach 2:
The patent provides dynamic control over surface energy parameters, allowing adjustment between increasing or decreasing surface energy depending on the specific printing requirements. This flexibility enables optimization of both printing precision and morphology uniformity under different conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively modifies the surface energies of substrate patterns, enabling precise control over ink spreading and film formation, resulting in improved continuity and uniformity of thin film patterns, suitable for both high precision and uniformity in printing.
Implementation Method 1
a surface treatment for forming a self-assembled monomolecular layer
Implementation Method 2
making a self-assembled monomolecular layer on the substrate pattern
Implementation Method 3
a surface treatment by ultraviolet-ozone cleaning
Data Source
AI summary
A method for surface treatment is disclosed which relates to the technical field of producing thin-film devices by printing and solves the problem that the treatment of a substrate surface in the prior art can hardly meet the requirement for printing. The method for surface treatment includes a step of subjecting a surface of a base plate having at least two kinds of substrate patterns formed thereon to a surface treatment for forming a self-assembled monomolecular layer for at least once and a surface treatment by ultraviolet-ozone cleaning, so as to make the difference between the surface energies of the substrate patterns larger or smaller. The method for surface treatment of the invention is suitable for the surface treatment of the substrate surface during producing thin-film devices by printing.