Substrate Temperature Control for Particle Adhesion Prevention

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in preventing particle adhesion to substrates during transfer, as conventional methods like HEPA filters and temperature gradients are insufficient, especially for small particles, and may require high temperatures or energy, which can affect wafer quality and throughput.

Innovation Solution

A substrate processing apparatus with a temperature control unit that adjusts the temperature of the substrate and chamber internal temperatures to create a temperature gradient, maintaining the substrate at a higher temperature than the chamber, preventing particle adhesion through a thermophoretic force without heating the substrate excessively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If HEPA filter or ULPA filter is used to supply clean air to the transfer chamber, then particle contamination is reduced, but small particles and molecules (lubricant, water, ammonia) cannot be completely removed

Engineering Contradiction:

Improveparticle contaminationVSAvoidcomplete particle removal

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent changes the temperature parameter of the substrate, maintaining it at a higher temperature than the chamber environment. This temperature differential creates a thermophoretic force that prevents particle adhesion, addressing the limitation of filters that cannot completely remove all types of contaminants including small molecules and lubricant particles

Inventive Principle:

Principle #35Parameter changes

2Object-affected harmful factors

If high temperature is applied to prevent particle adhesion, then particle adhesion is reduced, but substrate quality may be degraded and energy consumption increases

Engineering Contradiction:

Improveparticle adhesionVSAvoidsubstrate temperature

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The patent applies local quality by creating a temperature gradient where only the substrate surface is maintained at a higher temperature than the chamber, rather than heating the entire chamber. The temperature difference is controlled to be sufficient for particle prevention but limited to avoid substrate degradation

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent optimizes the temperature parameter by maintaining the substrate at a higher temperature than the chamber (reversing the conventional approach), creating a thermophoretic force that prevents particle adhesion while controlling the temperature differential to avoid substrate damage

Inventive Principle:

Principle #35Parameter changes

3Object-affected harmful factors

If conventional temperature gradient methods are used with chamber hotter than substrate, then particle adhesion is prevented, but excessive energy is consumed and substrate quality may be affected

Engineering Contradiction:

Improveparticle adhesionVSAvoidenergy consumption

Core Design Contradiction:

Object-affected harmful factorsVSUse of energy by moving object

Solution Approach 1:

The patent inverts the conventional temperature gradient approach by making the substrate hotter than the chamber environment, rather than heating the entire chamber. This reversal creates the necessary thermophoretic force while minimizing energy consumption and avoiding substrate quality degradation from excessive heating

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively prevents particle adhesion to substrates during transfer, maintaining substrate cleanliness and quality while minimizing energy consumption and thermal impact on the substrate.

Implementation Method 1

maintaining the substrate at a higher temperature than the chamber, preventing particle adhesion through a thermophoretic force

Methodology Applied

Scientific EffectThermophoresis: Thermophoresis

Data Source

PatentUS8950999B2Substrate processing apparatus and particle adhesion preventing method

Publication Date: 2015.02.10 TOKYO ELECTRON LTD

AI summary

Any particle adhesion onto the surface of a substrate to be processed is prevented. There is provided a substrate processing apparatus characterized by including a transfer chamber for, via a gate to which a substrate accommodating container for accommodation of the substrate is set, performing transfer of the substrate between the same and the substrate accommodating container, a processing chamber for applying a specific process to the substrate, a load-lock chamber for linking the processing chamber with the transfer chamber, and a temperature control unit for at the stage of transferring the substrate into at least one of the transfer chamber and the load-lock chamber, so as for the temperature of the substrate just before the transfer thereof to be higher than the temperature of the interior of the chamber, into which the substrate will be transferred, controlling at least one of the temperature of the substrate and the temperature of the interior of the chamber.