Substrate Test Wiring for Cut Alignment Verification
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Solution Overview
Problem
Conventional methods for manufacturing electronic devices, such as tiling display panels, require time-consuming and error-prone manual checks using optical microscopes to verify cutting and grinding results, which can lead to inefficiencies and inaccuracies.
Innovation Solution
A manufacturing method that involves creating a substrate with non-discarding and discarding portions, forming test wiring across these sections, and conducting tests to determine if the cutting and grinding meet specifications, eliminating the need for optical microscope verification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual checking using optical microscope is used to verify cutting and grinding results, then measurement precision can be achieved, but testing time is excessive and human errors increase
Solution Approach 1:
The patent replaces the manual optical microscope inspection method with an automated electrical resistance measurement system. Test patterns are formed on the substrate, and after cutting/grinding, the electrical resistance of these patterns is automatically measured to determine whether the cutting/grinding meets specifications, eliminating the need for time-consuming manual visual inspection while maintaining verification accuracy
Solution Approach 2:
The substrate itself serves as the test object through integrated test patterns. The electrical resistance of the test patterns directly indicates whether the cutting or grinding meets specifications, allowing the substrate to self-verify its own manufacturing quality without requiring external manual inspection, thus reducing testing time and human error
2Reliability
If manual checking using optical microscope is used to verify cutting and grinding results, then verification accuracy can be maintained, but human errors increase
Solution Approach 1:
The patent replaces manual optical microscope inspection with an automated electrical resistance measurement system. The electrical resistance values of test patterns are automatically measured and compared against predetermined thresholds to determine compliance, eliminating human subjective judgment and operational errors while maintaining reliable verification accuracy
Solution Approach 2:
The patent implements a feedback mechanism where the measured electrical resistance of test patterns is compared against predetermined reference values or thresholds. This automated feedback system objectively determines whether cutting or grinding meets specifications, eliminating human error in judgment while maintaining reliable verification through systematic comparison and decision-making
Data Source
AI summary
A manufacturing method of an electronic device is provided by the present disclosure. The method includes: providing a substrate including a non-discarding portion and a discarding portion adjacent to the non-discarding portion; forming a first test wiring extending through the non-discarding portion and the discarding portion; cutting the substrate on a target line, wherein the target line is aligned with a boundary between the non-discarding portion and the discarding portion; performing a first conducting test on the first test wiring; and determining the substrate to be in an off-target cutting state when a result of the first conducting test is a short circuit state, or determining the substrate to be in an on-target cutting state when the result of the first conducting test is an open circuit state.