Substrate Tile Pattern Correction Using Mask-Guided Etching
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Solution Overview
Problem
The existing tiling processes in microelectronics, optics, or optoelectronics face challenges with tile positioning and alignment errors due to differences in substrate sizes and the need for precise alignment for subsequent component manufacturing.
Innovation Solution
A process involving the placement of tiles on a support substrate, followed by the formation of a mask with a protective film and etching to correct the tile distribution and geometry according to a target pattern, ensuring precise alignment and minimizing errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the pick and place technique is used to transfer tiles individually to the support substrate, then the tiles can be positioned on the substrate, but tile positioning and alignment errors occur due to robot precision limitations
Solution Approach 1:
The patent applies preliminary action by forming a mask pattern on the tiles before transfer, which defines the precise target positions and orientations. This pre-established reference framework guides the tile placement process, allowing robots to deposit tiles at locations defined by the mask rather than relying solely on robot positioning precision. The mask serves as a pre-prepared template that compensates for positioning errors.
Solution Approach 2:
The patent replaces the mechanical positioning system (robotic pick and place) with a pattern-based guidance system. Instead of relying on mechanical precision of the robot to achieve accurate tile placement, the invention uses a deposited mask pattern that defines the geometric relationships between tiles. This substitution of mechanical positioning with pattern-based guidance resolves the contradiction between ease of operation and manufacturing precision.
2Adaptability or versatility
If tiles are transferred from a donor substrate with different size than the support substrate, then size mismatch is accommodated, but tile alignment and distribution errors occur
Solution Approach 1:
The patent introduces a mask pattern as an intermediary element between the tiles and the support substrate. This mask serves as a mediator that translates the geometric requirements from the donor substrate to the support substrate, accommodating size differences while maintaining precise tile distribution. The mask pattern defines the target geometry and acts as a reference framework that bridges the size mismatch between different substrates.
Solution Approach 2:
The patent applies parameter changes by modifying the geometric parameters of the mask pattern to match the target distribution on the support substrate. The mask pattern parameters (positions, orientations, spacing) are adjusted to compensate for size differences between donor and support substrates, thereby maintaining precise tile geometry and distribution despite the substrate size mismatch.
3Productivity
If rapid tile transfer is performed using automated techniques, then productivity is improved, but alignment precision and orientation accuracy deteriorate
Solution Approach 1:
The patent applies preliminary action by pre-forming the mask pattern that defines precise alignment references before the rapid tile transfer process. This pre-established geometric framework allows automated systems to quickly deposit tiles without compromising alignment precision, as the mask provides the reference information needed for accurate placement. The preliminary mask creation enables subsequent rapid transfer while maintaining precision.
Solution Approach 2:
The patent replaces reliance on mechanical positioning precision during rapid transfer with a pattern-based reference system. The mask pattern provides geometric guidance that compensates for the lower precision inherent in rapid automated transfer, allowing high productivity to be achieved without sacrificing alignment and orientation accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process effectively reduces tile positioning and alignment errors, enabling the precise manufacture of electronic components by ensuring accurate geometry and distribution of tiles on the support substrate.
Implementation Method 1
forming a mask comprising a protective film partially covering the tiles in a pattern defining the target distribution or geometry and at least one opening extending around the protective film
Implementation Method 2
etching at least one tile through the opening in the mask so as to correct the arrangement of the tiles according to the target distribution or geometry
Data Source
AI summary
A method of manufacturing a structure comprising at least two tiles on a substrate comprises: —placing, on a support substrate, at least two tiles, the tiles being arranged on the support substrate in an incorrect distribution and/or geometry compared with a target distribution and/or geometry; —forming a mask comprising a protective film partially covering the tiles in a pattern defining the target distribution and/or geometry and at least one opening extending around the protective film; and —etching at least one tile through the opening in the mask so as to correct the arrangement of the tiles according to the target distribution and/or geometry.