Nanostructure Transfer Actuator for Substrate Tilting Control
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Solution Overview
Problem
Existing substrate structuring methods face challenges with high production costs and low throughput due to the use of large dies, especially with asymmetrical filling factors, leading to tilting, drifting, and scrapping issues, particularly on non-flat substrates like round ones, which reduces edge yield and increases production costs.
Innovation Solution
A system with a substrate holder and an actuator device that applies a controllable and regulatable force orthogonal to the substrate surface, allowing for precise positioning and force adjustment to prevent tilting and drifting, enabling the use of smaller dies with improved edge yield and throughput by distributing forces uniformly across the die surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If large dies are used for substrate structuring, then the structuring area is improved, but the risk of die tilting and drifting increases leading to uneven structuring and scrapping
Solution Approach 1:
The patent divides the single large die into multiple smaller dies arranged in an array. Each small die structures a specific region of the substrate independently. This segmentation prevents tilting and drifting issues associated with large dies while maintaining comprehensive substrate coverage through coordinated operation of multiple dies.
Solution Approach 2:
The patent introduces counterbalancing mechanisms that apply opposing forces to compensate for die tilting and drifting tendencies. By implementing counterweight systems, the die positioning stability is maintained during the structuring process, preventing uneven structuring even when using larger effective die areas.
2Ease of manufacture
If smaller dies are used in step-and-repeat process, then the die production cost is reduced, but the production time increases due to multiple intermediate steps
Solution Approach 1:
The patent combines multiple small dies into a coordinated array system that operates simultaneously or in optimized sequence. By merging the functionality of multiple dies while maintaining their individual advantages, the system achieves both cost-effectiveness and improved throughput compared to traditional step-and-repeat processes.
Solution Approach 2:
The patent implements preliminary positioning and force distribution planning before the actual structuring process. By pre-configuring the die array positions and force application points, the system eliminates intermediate adjustment steps, thereby maintaining the cost advantages of small dies while significantly improving production throughput.
3Quantity of substance
If asymmetrical die structure is used, then the filling factor is improved, but the die tilting and drifting during embossing increases causing scrapping
Solution Approach 1:
The patent intentionally employs asymmetrical die structures with optimized filling factors for specific application requirements. By carefully designing the asymmetrical geometry and compensating through controlled force application, the system maintains both high filling factor and die positioning stability during embossing operations.
Solution Approach 2:
The patent dynamically adjusts process parameters such as force magnitude and application points during embossing operations. By changing these parameters in real-time, the system compensates for the instabilities introduced by asymmetrical die structures, maintaining both high filling factor and positioning stability throughout the structuring process.
4Manufacturing precision
If die size is reduced to chip dimensions for optimum edge yield, then the edge yield is improved, but the throughput drops and production costs increase
Solution Approach 1:
The patent transitions from using a single large die to a two-dimensional array of multiple small dies. This dimensional change allows the system to achieve high edge yield by using chip-sized dies while maintaining high throughput through parallel or sequential operation of multiple dies across the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system enhances edge yield up to 100% and reduces production costs by allowing the use of smaller dies with improved structural uniformity and precision, even on non-flat substrates, while maintaining high throughput and preventing scrapping.
Implementation Method 1
an actuator device that can be oriented parallel to the substrate receiving surface and opposite to this movable structural surface of the die and that acts orthogonally to the substrate receiving surface
Data Source
AI summary
A system for transferring a nanostructure from a die to a flat side of a large-area substrate. The system has a substrate holder that receives the substrate on a substrate receiving surface. A structural surface of the die is oriented parallel to and opposite the substrate receiving surface. An adjusting means receives the substrate holder and adjusts the position of the substrate relative to the die in an x-direction, y-direction and a rotational direction. An actuator device includes at least two separately controllable actuators that each independently imposes a force in a direction orthogonal to the substrate receiving surface. A force measuring cell is in each actuator for measuring the force applied on the die or substrate. The forces, in combination, produce a single, controllable resultant force at a predetermined location. The single, resultant force is orientated in a direction orthogonal to the substrate receiving surface of the substrate holder.