Substrate Transfer Mechanism With Carrier Lift Pins for Low-Particle Handling
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Solution Overview
Problem
Conventional substrate transfer methods in processing tools often result in particle generation and damage due to contact with lift pins, leading to contamination and reduced yield in semiconductor fabrication processes.
Innovation Solution
A substrate processing system with a substrate input/output chamber and transfer chamber, utilizing carrier holders with support members and lift pins made of softer materials to minimize contact with the substrate, and a susceptor with a groove to reduce particle contamination during transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional substrate lift pins contact the backside of the substrate during transfer, then the substrate can be moved within or between chambers, but particles are generated and substrate damage occurs
Solution Approach 1:
A carrier is introduced as an intermediary object between the lift pins and the substrate. The lift pins contact the carrier instead of directly contacting the substrate, thereby preventing particle generation and damage to the substrate while still enabling substrate transfer through the carrier-mediated lifting mechanism
Solution Approach 2:
The carrier acts as a disposable or replaceable component that absorbs the wear and potential contamination from lift pin contact. By sacrificing the carrier rather than the substrate, the system protects the valuable substrate from damage and particle generation during transfer operations
2Productivity
If lift pins contact the substrate backside during transfer, then substrate movement is enabled, but substrate scratching and contamination occur
Solution Approach 1:
The carrier serves as a protective intermediary that the lift pins contact instead of the substrate. This maintains efficient substrate transfer through the carrier lifting mechanism while preserving substrate surface integrity by eliminating direct pin-substrate contact that causes scratching and contamination
3Adaptability or versatility
If substrates are transferred in a multi-chamber tool, then processing functions are enabled, but particle contamination of chambers and substrates increases
Solution Approach 1:
The carrier acts as a mediator during inter-chamber substrate transfer, allowing lift pins to contact the carrier rather than the substrate. This enables versatile multi-chamber processing operations while reducing particle contamination of both chambers and substrates by preventing direct contact between lift pins and substrate surfaces
Data Source
AI summary
A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.